NAME	THESIS	PRESENT STATUS
SAMPATHKUMAR, VAIDEESWARAN	Throughput Improvement in the CAB Shop of an existing Automotive Assembly Plant Using Computer Simulation as a Tool	Manufacturing Controller, General Motors, Edison, NJ
VITHLANI, PRASHANT	Estimating Manufacturing Standard Times in an EMS Provider's Environment	Application Engineer,Universal Instruments Corporation, Binghamton, NY
SITARAMAN, MADAN MOHAN	Research in the Rework of Lead-Free Area Array Assemblies	Member of Technical Staff (MTS), VLSI Technology, Shelton, CT
POCHAREDDY, SUBHASH	High Speed High Density PCB Design and Manufacturing	Ciena
XIANG, ZHOU	Yield Modeling In an Electronics Manufacturing Service Provider's Environment	Process Engineer, Solectron Technical Centre, San Jose, CA
MUN, JI-HYON	Process Mapping and Its Use in Determining Factory Layouts in an EMS Environment	Ph.D., SUNY, Binghamton, NY
JOSHI, JAYDUTT	Reliability Analysis of Microvias and Other High Density Board Structures	Packaging Engineer, Conexant Technologies Inc., Newport Beach, CA
PATWARDHAN, VIRAJ	Reliability Issues in Direct Chip Attach Assemblies using Reflow or No Flow Underfills	Engineering Manager, Intersil Corporation, Milpitas, CA
GOPALAN, BALAKRISHNAN	Process and Reliability Issues for Thermally Enhanced Flip Chip Ball Grid Array (FC-BGA) Packages	Production Team Leader, GE Marquette, Milwaukee, WI
MUNIKRISHNAN, MANIKANDAN	A Monte Carlo Simulation to Predict the Placement Yield of Area Array Devices	Supply chain - Senior Consultant, Cap gemini Ernst& Young Consultants LLp, New York City, NY
VASUDEVAN, MURUGAN	Solder Deposition Through Stencil Printing for Automotive Electronics Assembly	Manufacturing Engineer, CISCO Systems, San Jose, CA
MOHAMMAD, YUNUS	Transition to Lead-Free Processes - Issues and Concerns	Not Available
PHADNIS, SACHIN	Decision Support For BGA Assembly	Research Specialist, SUNY Binghamton, NY