NAME	THESIS	PRESENT STATUS
NAGARAJAN, SRIDHAR	High density compliant pin connectors - Assembly process issues and solutions	Manufacturing Scientist, IBM, Endicott, NY
MOHAN, VINOD	Factors Affecting Solderability of Sn/Ag/Cu Solder on Alternate Pad Finishes	Not Available
MARQUEZ, URSULA	Reliability of Blind and Buried Microvia Structures	Not Available