NAME	THESIS	PRESENT STATUS
LEE, TAE-HAN	Process Study in Ultrafine Pitch Hot Bar Reflow Soldering	Northeastern University, Boston, MA
CHUNG, CHAO-WEN	Closed Loop Process Control for Solder Paste Stencil Printing	Sr. Package Development Engineer, LSI Logic, Milpitas, CA
ALEXANDER, MATHEW	Manufacturing Cost Analysis of Surface Mount PCB Design	Not Available
KRISHNAN, SUBRAMANIAM	Design For Manufacturing for Surface Mount PCB Assembly	Sr. Research Engineer, General Motors Corporation, Warren, MI
GLEASER, COLETTE MARIE	Accuracy Evaluation Methodology in Fine Pitch Surface Mount Placement Equipment	Allen Bradley, AB
HWANG, YU-LIN	An Adaptable Knowledge Base For Design for Manufacturability by an Object-Oriented Approach	CA
SPIEGEL, JONATHAN	Validation and Testing for Solder Paste Evaluation Procedures	Not Available
BRIGGS, DAVE	Knowledge Based Profile Identification In Surface Mount PCB Assembly	Not Available
HUANG, CHIEN-YI	Solderability Testing and Evaluation by Wetting Balance Analysis	Ph.D. Professor, Department of Industrial Management, Huafan University, Taipei, Taiwan