NAME	THESIS	PRESENT STATUS
SESHADRI, CHEENU	Solder Paste Rhelogy and Print Behavior	PC Assembly Manager, Wavetek Wandel Goltermann, Indianapolis, IN
THOMAS, SUNIL	Measurement of Component Retention Properties of Solder Pastes for Printed Wiring Board Assembly	Manager- Application Engineering, Texas Instruments, Dallas, TX
BAOUCHE, HOCINE	Testing and Evaluation of the Solder Bumps and Bump Pattern Locating Algorithms	Not Available
MONTOCCHIO, NARISA	Accuracy Evaluation Methodology for Three Dimensional Laser Based Solder Inspection	Procurement Engineer, Hewlett Packard GPS, Bangkok, Thailand