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NAME THESIS PRESENT STATUS
KINI, NAVEEN Effect of Board Bumping, Board and Component Related Parameters on DCA Assembly Yields Sr. Manufacturing Engineer, Smart Module Systems, Fremont, CA
NAGARAJAN, KUMAR A Computer Aided Cost Estimation System for BGA/DCA Package Development Engineer, LSI Logic, Milpitas, CA
RAJAGOPALAN, SARATHY Solder Paste and Flux in Area Array Assembly Package Development Engineer, LSI Logic, Milpitas, CA
VENKATESWARAN, SUNDARAM Comprehensive Process Control for Solder Paste Stencil Printing American Airlines, Dallas, TX
FOSBERRY, JENNIFER An Investigation of the Physical Properties and Flow Behavior of Encapsulant Materials for Direct Chip Attach Applications Tessera Inc., San Jose, CA
GURUMURTHY, CHARAN Warpage in Area Array Microelectronics PhD., IBM Microelectronics, Assembly Process Design, Endicott, NY
KU, KUO-CHENG A Computer Aided Process Planning System for Manual Printed Wiring Board Assembly QA Engineer, Taiwan Semiconductor Manufacturing Company (Hsin - Chu), Taiwan

 

 
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