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| Masters Alumni (1996)
| NAME |
THESIS |
PRESENT STATUS |
| KINI, NAVEEN |
Effect of Board Bumping, Board and Component Related Parameters on DCA Assembly Yields |
Sr. Manufacturing Engineer, Smart Module Systems, Fremont, CA |
| NAGARAJAN, KUMAR |
A Computer Aided Cost Estimation System for BGA/DCA |
Package Development Engineer, LSI Logic, Milpitas, CA |
| RAJAGOPALAN, SARATHY |
Solder Paste and Flux in Area Array Assembly |
Package Development Engineer, LSI Logic, Milpitas, CA |
| VENKATESWARAN, SUNDARAM |
Comprehensive Process Control for Solder Paste Stencil Printing |
American Airlines, Dallas, TX |
| FOSBERRY, JENNIFER |
An Investigation of the Physical Properties and Flow Behavior of Encapsulant Materials for Direct Chip Attach Applications |
Tessera Inc., San Jose, CA |
| GURUMURTHY, CHARAN |
Warpage in Area Array Microelectronics |
PhD., IBM Microelectronics, Assembly Process Design, Endicott, NY |
| KU, KUO-CHENG |
A Computer Aided Process Planning System for Manual Printed Wiring Board Assembly |
QA Engineer, Taiwan Semiconductor Manufacturing Company (Hsin - Chu), Taiwan |
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