NAME	THESIS	PRESENT STATUS
PRASAD, SWAMINATH	Adhesive Deposition Through Stencil Printing for Surface Mount Assembly	Senior Engineer, ChipPac Incorporated, Santa Clara, CA
KALYAN, KRISHNA	Effect of Board and Package Related Parameters on Area Array Package Assembly Yields	Process Engineer, Motorola, Schaumburg, IL
SATAGOPAN, SANTHANA	Effect of the Filling and Release Processes on Solder Paste Volume Transferred in the Stencil Printing Process	Advanced Manufacturing Engineer, Nortel Networks, Santa Clara, CA
RIELLY, LISA	A Systematic Evaluation of Adhesive Deposition for Mixed Technology Assemblies	Baush & Lomb, Rochester, NY