NAME	THESIS	PRESENT STATUS
CAI, MINGQI	Development of a Hypermedia Based Decision Support System For PCB Assembly	Senior Web Developer, www.Enablx.com, Randolph, NJ
NITHYANANDAN, VANGAL THIRUMALAISWAMY	Implementation of The Pin-In-Paste Process in a Contract Manufacturing Facility	Advanced Manufacturing Engineer, Nortel Networks, Santa Clara, CA
PUTCHA, UDAY	Underfill and Failure Analysis for DCA Assembly	Manufacturing Engineer, Qualcomm, San Diego, CA
RANJAN, MANISH	Process, Design and Reliability Issues in DCA Assembly	Senior Applications Engineer, VTC Inc., Bloomington, MN
ERICH, ROBERT	Failure and Embrittlement of Solder Joints in Fine Pitch Area Array Components	Product Manager - Flip Chip CSP, Amkor Technology, Chandler, AZ
SEENIRAJ, RAMPRASAD	Study of Strength, Reliability and Other Issues Concerning the AART Solder Joints	Project Engineer, Solectron, Milpitas, CA
GOPALAKRISHNAN, LAVANYA	Process Planning For Ultrafine Pitch and Area Array Surface Mount Assembly	Manufacturing Engineer, Cyras, Fremont, CA
MURTHY, SHAILESH	Stencil Printing and Solder Paste Issues for Alternate Assembly and Reflow Technology	Advanced Manufacturing Engineer, Nortel Networks, Billerica, MA
TONAPI, SANDEEP SHRIKANT	Pin-In-Paste Process Development - A Production Perspective	Packaging Engineer, GE Corporate, Niskayuna, NY
GREENE, CHRISTOPHER M.	The Reduction of Post Placement Defects in Surface Mount Assembly	Quality Engineer, IBM, Endicott, NY
HINERMAN, JAY	Comprehensive Guidelines for the Alternate Assembly and Reflow Technology	Senior Applications Engineer, DEK Printing Machines, USA Inc., Flemington, NJ
SCHAKE, JEFFREY	Investigation of Bump Distributions from the Stencil Printing Wafer Bumping Process	Senior Engineer, DEK Inc./ Universal Instruments Corporation, Binghamton, NY