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| Masters Alumni (1999)
| NAME |
THESIS |
PRESENT STATUS |
| LIMAYE, ABHIJIT |
Process Development For Area Array Rework in an Electronics Manufacturing Service (EMS) Environment |
Process Engineer, Flextronics International, San Jose, CA |
| VENKATESWARAN, MUTHIAH |
Flip Chip Process Development & Reliability Evaluation |
Package Development Engineer, Texas Instruments,Dallas, TX |
| RAMAKRISHNAN, SREERAM |
Procurement Lead Time Reduction in an EMS Facility Using an Agent Based System |
Research Staff Member, T.J. Watson Research Center, IBM Research,
Yorktown Heights, NY |
| HETE, AMEYA |
Implementation of an Automated Data Acquisition System For Electronic Packaging |
System Analyst, Cabletron Systems, Rochester, NH |
| LIN, CHANGHONG |
Rework Process Development For Large Area Array Devices in High Density Networking Products |
Test Development Engineer, Nortel Networks, Santa Clara, CA |
| PALSHIKAR, PARAG |
Systematic Implementation of A No-Clean Process In A Contract Manufacturing Environment |
Associate Manufacturing Engineer, Solectron Inc., Milpitas, CA |
| JAYARAMAN, SURESH |
Evaluation of Reliability of Small Z-Axis Inter Connects |
Packaging Engineer, Conexant Technologies, Inc., Newport Beach, CA |
| YAMUNAN, VINU |
Assembly Process Development For Large Area Array Devices |
Package Development Engineer, Texas Instruments, Dallas, TX |
| JOSHI, MUKUL |
Encapsulant selection and Reliability issues in Flip Chip assemblies |
Process & Material's Development Engineer,LSI Logic, Milpitas, CA |
| PATEL, PARVEZ |
Assembly process development for Ball Grid Array and Chip Scale Package on high density interconnects |
Motorola, AMST Group,Libertyville, IL |
| ARSLAN, NESE |
Eco Management using Intelligent Agents in an EMS provider's environment |
Application Consultant, IMS, Yazilim, Turkey |
| ALAWANI, ASHISH |
Integration of Advanced Area Array Packages and Microvia Technology with Standard surface Mount Processes |
Packaging Engineer, Packagind Development Platform Technologies,Conexant Technologies, Inc., Newport Beach, CA |
| CHENG, LIYUN |
Evaluation of Underfill Materials for DCA Applications |
PhD., SUNY, Universal Instruments, Binghamton, NY |
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