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| FULL LISTING (11)
| NAME |
THESIS TITLE |
PRESENT STATUS |
| YANG, CHAN-JER |
A Systematic Approach for the Optimization of Ultrafine Pitch and Area Array Assembly |
TAIWAN, MAY 1998 |
| CHUNG, CHAO-WEN |
Rework of Area Array Components |
Sr. Package Development Engineer, LSI Logic, Milpitas, CA - January 1997 |
| HUANG, YU-WEN |
Yield Estimation for Surface Mount Area Array Devices |
Institute of Microelectronics (IME), Singapore - January 1997 |
| HUANG, CHIEN-YI |
Yield Estimation for Surface Mount Area Array Devices |
Institute of Microelectronics (IME), Singapore - January 1997 |
| SHIH, WURONG |
A Distributed Artificial Intelligence Based System for Manufacturing Systems Control in PCB Assembly |
Associate Professor,Nan-Tai Institute of Technology, Taiwan - February 1996 |
| CHU, ERIC HAI-CHENG |
A Distributed Co-operative Homogeneous Multi Agent Approach for Parallel Fuzzy Expert Systems in Surface Mount PWB Assembly |
Associate Professor,FengChia University, Taichung, Taiwan - December 1995 |
| WU, CHIEN-HSING |
Knowledge Acquisition for Fuzzy Knowledge Base Development in Surface Mount PWB Assembly |
Associate Professor, Kuang Shan Inst. of Technology, Taiwan -July 1995 |
| SU, YANN-YEAN |
A Prototype Decision Support Framework for Surface Mount PWB Assembly |
Not Available - May 1995 |
| CALA, MARTIN |
An Intelligent Model Based Process Planning Methodology for Surface Mount Technology |
Associate Professor, Youngstown State University, Youngstown, OH - December 1990 |
| GREENE, CHRIS |
Lead Free Stencil Printing For EMS Providers |
Quality Engineer, IBM,Endicott, New York - May 2001 |
| TONAPI, SANDEEP |
Assembly and Reliability of Lead-free Flip Chips |
Packaging Engineer, GE Corporate, Niskayuna, NewYork - May 2001 |
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