Fienfocus X-Ray Inspection Equipment
(Fein Focus Series FXS 100.23)
Manufacturer: Fienfocus
Applications:
X-Ray microscopy, a non-contact, non-destructive inspection method, reveals the interior details of components with high definition. The high clarity of an X-ray microscopic image of the inside of materials, components and assemblies provides reliable diagnosis and rapid detection of the causes of flaws. Typical applications are semiconductor bonding tests, bare board registration of inner layers, populated printed wiring board solder joint inspection and ceramic material flaw inspection.
Main Features:
- Radiation-protection sample chamber
- Integrated X-Y-Z manipulation system
- Tilt and Rotate control arm which makes this a 5 axis machine
- Real time TV imaging
- Magnification Zoom of 2X to 80X
- 30 - 100kv High Voltage Range
- 0.05 - 0.4 ma Tube Current Range
- 40E Conical Beam angle
- Maximum sample size is 12" x 15"
- Voiding calculation software
Instrumentation:
- MS-DOS operating system
- Menu driven Digital Imaging Enhancement processing
- Processed or enhanced images can be archived on hard disk and/or floppy disc in TIFF-G format
- Processed or enhanced images can be archived on Polaroid film or X-Ray film
- Instant thermal print images
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