Applications:

These characterization tools are used to analyze visco-elastic materials used in electronics packaging including solder paste, epoxy underfills, and conductive adhesives. Relationships between rheological properties and the actual performance parameters of a material are used to improve the existing formulations.

Main Features:

• Controlled stress rheometer with limited controlled strain capability. Measurements can be made in the linear visco-elastic region without disturbing the fluid's structure.
• Rheological parameters that can be measured include viscosity, complex viscosity, kinematic viscosity, storage modules, loss modules, and compliance.
• The rheometer can be operated in three modes: oscillation, creep, and flow.
• Automatic gap setting with 0.01 micron resolution.
• Temperature range Standard (Peltier): -5 to 99 C. Extended temperature module (induction heating): -100 to 400 C. Precision +/- 0.1 C.
• Maximum torque: 0.05 Nm (500 K dyne.cm).
• Windows based software with capability of curve fitting to pre-set or user-defined models, modeling, editing, and statistical analysis.

• Parallel-plate and cone-and-plate geometries in various sizes.
• Extended temperature module enclosure.