The M-8AN Flip Chip Aligner Bonder is a microprocessor controlled visible optics system that permits rapid, repeatable alignment and bonding of a flipped die to a substrate. This is accomplished by inserting a dual sensor optical probe between the die and the substrate and processing the images through a video overlay system. This provides super imposed images on a video screen. Once the images have been aligned to coincide, the optical probe is withdrawn and the die and the substrate, now parallel with each other and properly aligned, are brought into contact and bonding is initiated. Pre-programmed pressure and temperature profiles are followed to ensure proper bonding for the type of contact pads being bonded. The M-8AN accommodates a variety of contact pads and can be programmed to use any combination of pressure, substrate heating and die heating (optional) to make reliable contacts.

Specifications:

• Six Axis alignment
• Auto Collimator (Visible)
• In line Contact Force Indicator
• Temperature Controlled Lower Heated Chuck (00¡ã C)
• Temperature Controlled Upper Heated Chuck
• Custom Chucks to hold Various Samples
• Motorized X-Y Camera Scanning
• Motorized Focusing
• Non- Contact Optical Leveling Range (3 degrees)
• X- Y Dynamic Range ( 25mm)
• Theta Dynamic Range ( 10)
• Contact Dynamic Force (-50 lb)
• Vacuum 22" mercury
• Air Regulation 40-60 PSI
• Water Circulation Lower Heated Chuck