DESCRIPTION:

• The speed of each rail is also independently adjustable, allowing for two distinct temperature profiles to run simultaneously in the oven thus supporting both reflow and snap curing.
• The ability to convey two production lines concurrently, processing any combination board sizes and conveyor speeds, can eliminate the need and the space requirement for a second oven.
• New, enlarged heating tunnels and baffle-free design for 25% higher airflow, enhanced plus robust, heavy-duty temperature uniformity, repeatability and high-load handling.
• Module response of less than one second to temperature changes of less than 0.1oC, thereby maintaining profile integrity for heavy board loads.
• Single edge hold conveyor adjustable for boards as wide as 23.5 inches (60cm) or a dual-rail edge hold conveyor; each side is independently speed-adjustable for boards as wide as 10 inches (25.4cm).
• Total forced convection using air or inert atmosphere, with nitrogen consumption levels as low as 850 SCFH (23.8 m3/hour) at 25 PPM.
• PC-driven PID closed-loop controller capable for networking in a CIM environment.
• Advanced five-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
• Optimal thermocouple location in the air stream for fast response and accurate zone temperature control.
• Rapid profiling changes plus fast warm-up cool-down.
• Wide process window for "universal profiling"- allows many different boards to be run on a single temperature profile.

System Features:

• The most efficient heat transfer, from extra high-volume, high-velocity, heating modules, producing temperature gradients of less than 2oC throughout the oven.
• Instant-response heating modules that react in less than one second to temperature changes of less than 0.1oC to maintain profile integrity for heavy board loads.
• Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment.
• The lowest nitrogen consumption in the industry: 350 SCFH* with our Ultra Low option.
• Six-sigma reliability for the most demanding production environments.
• Single or dual-rail edge hold conveyor for greater versatility in board handling.
• Pure convection technology provides flexibility to produce any solder paste manufacturer's recommended profile.
• User-friendly Windows TM software. Alternate curing configuration, with topside IR panels to create a temperature differential that protects heat-sensitive components.
• An optional UV module may be added for UV cure adhesives.