NAME	THESIS
T. Sparks	A Systematic Approach to Equipment Qualification in Automated Electronics Assembly
G. Servis	Voids and Their Impact on the Reliability on Lead-Free Solder Joints
S. Brewer	Rework of Lead Free Area Array Assemblies on Thick Substrates
K. Sudarsanam	Optimizing the Drilling Sequence for Thick Substrates
R. Lander	Process Optimization in Radiology Services
N. Prasad	Reducing Patient Turnaround Times in an Emergency Department
P. Bhargava	CAPP and ERP in High Mix Low Volume PCB Assembly
A. Acharya	Thermal Interface Materials in Electronics Manufacturing
J. Sturek	'Optimizing' the Efficiency of the Processing of Applications in Academia
S. Sajjala	Rework of Thin Lead Free Substrates
J. Therriault	The Impact of Voids on Lead-Free Solder Joint Reliability
J. Guinane	Conversion to Lead-Free Assembly Processes
Siu-Lung Ng	Systematic Process Development and Conversion to Lead-Free Assembly
R. Karuturi	Optimization of Facilities Planning in Automotive Electronics
N. Kulkarni	Real-time Quality Tracking and Control
A. Johnson	Optimization of Manufacturing Systems
G. Chennagiri	Process Research and Reliability Assessment Over Multiple Rework Cycles
Jing Li	Lead Free Process Development and Reliability Evaluation
A. Viswanathan	Process Research for 01005 Assembly
J. Bosire	Evaluation and Improvement of Radiology Services
J. Mari	Adapting Lean Processing Principles to Health Care.