Publications In Conference Proceedings (Fully Refereed - In Reverse Chronological Order)
  1. Koli, S., Damodaran, P., Kimbler, W., & Srihari, K., 'Optimal Product Slotting', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
  2. Pradhan, S., Damodaran, P., & Srihari, K., 'Performance Analysis of Manufacturing Systems With Job Failures Using Jackson Networks', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
  3. Poyyapakkam, V., Lam, S.Y., & Srihari, K., 'Estimation of Placement Process Throughput in Electronic Assemblies Using Neural Networks', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
  4. Batra, A., Murcko, R., S. Lu, & Srihari, K., 'Process Optimization of Plated-through-hole (PTH) Process using Evolutionary Operation (EVOP)', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
  5. Ramakrishnan, S., Courtney, A., Srihari, K. and Emmick, F., 'Streamlining the Workflow at the CT Scan Area of a Healthcare Provider', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
  6. Gowda, A., Esler, D., Paisner, S.N., Tonapi, S.S., Nagarkar, K., & Srihari, K., 'Reliability Testing of Silicone Based Thermal Greases', SEMITHERM 2005, San Jose, California, March 2005.
  7. Ramachandran, P., Damodaran, P., Madden, P., & Srihari, K., 'Optimal Placement by Branch-and-Price', Proceedings 每 Asia and South Pacific Design Automation Conference 2005, Shanghai, China, January 2005 (CD-ROM).
  8. Ramakrishnan, S., Nagarkar, S., DeGennaro, M., Srihari, K., Courtney, A., & Emick, F., 'A Study of the CT Scan Area of a Healthcare Provider', Proceedings 每 2004 Winter Simulation Conference, Washington, DC, December 2004 (CD-ROM).
  9. Gowda, A., Esler, D., Tonapi, S.S., Nagarkar, K., & Srihari, K., 'Voids In Thermal Interface Materials and Their Effect on Thermal Performance', EPTC 2004, Singapore, December 2004 (CD-ROM).
  10. Ramakrishnan, S., Kayande, S., & Srihari, K., 'Intelligent Process Control in an EMS Environment', Proceedings 每 ASME IMECE, Anaheim, California, November 2004 (CD-ROM).
  11. Pradhan, S., Arbulich, J., & Srihari, K., 'Testability of Erbium Doped Fibers 每 An Approach Towards Yield Improvement', Proceedings 每 ASME IMECE, Anaheim, California, November 2004 (CD-ROM).
  12. Mukadam, M., Schake, J.,Borgesen, P., & Srihari, K., 'An Investigation of Assembly Process Variables and their Impact on Voiding at a Thermal Interface', Proceedings - ITHERM 2004, Las Vegas, Nevada, June 2004 (CD-ROM).
  13. Gowda, A., Esler, D., Esler, D., Tonapi, S.S., Zhong, A., Schattenmann, F., and Srihari, K., 'Micron and Sub-Micron Scale Characterization of Interfaces in a Thermal Interface Material System', Proceedings - ITHERM 2004, Las Vegas, Nevada, June 2004 (CD-ROM).
  14. Nivarthi, S., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Enhancement of the Utilization of a Suite of Operating Rooms', Proceedings - Industrial Engineering Research Conference, Houston, Texas, May 2004 (CD-ROM).
  15. Nivarthi, S., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Effective Utilization of Ancillary Services to Reduce Patient Turnaround Times at an Emergency Room', Proceedings - Industrial Engineering Research Conference, Houston, Texas, May 2004 (CD-ROM).
  16. Gowda, A., Zhong, A., Esler, D., Esler, D., David., J., Tonapi, S.S., Schattenmann, F., and Srihari, K., 'Design of a High Reliability and Low Thermal Resistance Thermal Interface Material', Proceedings - EPTC 2003, Singapore, December 2003 (CD-ROM).
  17. Pradhan, S., Arbulich, J., & Srihari, K., 'Splice Loss Optimization of Single Mode Fiber and Erbium Doped Fiber 每 Experiments and Issues', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
  18. Mukadam, M., Meilunas, M., Borgesen, P., & Srihari, K., 'Study of Alternate Surface Finished for Quad Flat Packs', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
  19. Gowda, A., Primavera, A.A. & Srihari, K., 'Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
  20. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Continuous Improvement in the Health Care Arena Through The Application of Industrial Methods', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
  21. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Reducing Patient Turnaround Time in an Emergency Room', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
  22. Brinthaupt, M., Jadhav, H., Testani, M., Murcko, M., & Srihari, K., 'Establishing Design for Manufacturability (DFM) Criteria in a Low Volume, High Mix Electronics Manufacturing Environment', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
  23. Gnanasambandam, N., Grebe, V., Testani, M., Murcko, R., & Srihari, K., 'The Identification of Defect Clusters in Electronics Manufacturing', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
  24. Shah, A., Sammakia, B.G., Srihari, K., & Ramakrishna, K., 'Numerical Optimization Study for a Parallel Plate Impingement Heat Sink', Proceedings - INTERPACK 2003, Hawaii, July 2003.
  25. Su, J., Marrey, S., Damania, J., Murcko, R., & Srihari, K., 'An Integrated Capacity Planning Tool in a High Mix EMS Environment', FAIM 2003, Tampa, Florida, June 2003, pp.579-589.
  26. Wable, G., Chu, Q., Damodaran, P., Phadnis, S., & Srihari, K., 'A Systematic Procedure for Selection of a Lead-Free Solder Paste at an Electronics Manufacturing Environment', FAIM 2003, Tampa, Florida, June 2003, pp.770-781.
  27. Muthaiyan, R., Nagarajan, S., & Srihari, K., 'Optimization of Inspection through the Implementation of an Information System', FAIM 2003, Tampa, Florida, June 2003, pp.590-601.
  28. Joshi, A., Phadnis, S.S., Srihari, K., & Seeniraj, R., 'Use of Simulation to Improve the Kitting Process at an EMS Provider's Facility', Computers and Industrial Engineering Conference, San Francisco, California, February 2003 (CD-ROM).
  29. Phadnis, S.S. & Srihari, K., 'Yield Estimation for BGA Assembly', Computers and Industrial Engineering, San Francisco, California, February 2003 (CD-ROM).
  30. Muthaiyan, R., Barba, V., & Srihari, K., 'Statistical Process Control for Solder Deposition and Yield Enhancement', Computers and Industrial Engineering, San Francisco, California, February 2003 (CD-ROM).
  31. Vellore, T.K., Craik, J., Phadnis, S., & Srihari, K., 'Information-Driven Inspection Strategies for AOI and AXI Equipment in Surface Mount Manufacturing', Computers and Industrial Engineering Conference, San Francisco, California, February 2003 (CD-ROM).
  32. Harvilchuck, L., Borgesen, P., Kondos, P., Gopakumar, S., & Srihari, K., 'Passive Optoelectonics Component Manufacturing 每 A Case Study', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
  33. Gopakumar, S., Poyapakkam, V., Borgesen, P., Blass, D., & Srihari, K., 'Lead-Free Flip Chip Assembly', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
  34. Venkateswaran, M., Borgesen, P., & Srihari, K., 'Evaluation of a Conductive Adhesive Based Approach to Lead-Free Flip Chip Assembly', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
  35. Vellore, T.K., Venkatesh, R.S., Balasubramanian, S., Craik, J., & Srihari, K., 'Information Systems for the Realtime Control of an Integrated Production Environment', Proceedings - FAIM 2002, Dresden, Germany, July 2002, pp.219-228.
  36. Mun, J-H. & Srihari, K., 'Capacity Requirements Planning for Electronics Manufacturing', Proceedings - FAIM 2002, Dresden, Germany, July 2002, pp.229-236.
  37. Shah, A., Sammakia, B.G., Srihari, K., & Ramakrishna, K., 'A Numerical Study of the Thermal Performance of an Impingement Heat Sink 每 Fin Shape Optimization', Proceedings - ITHERM 2002, San Diego, California, May 2002 (CD-ROM).
  38. Jumani, S., Lam, S., & Srihari, K, 'Using Simulation as a Design and Planning Tool for New Manufacturing Systems', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
  39. Mohan, V., Vichare, N., Muthiayan, R., & Srihari, K, 'Dispense Expert - A Guide for Underfill Dispensing for Flip Chip Assembly', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
  40. Manjeshwar, P., Shaherwala, S., Craik, J., & Srihari, K, 'Optimizing Solder Paste Deposition for a High Volume - Low Mix SMT Line', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
  41. Tonapi, S.S., Borgesen, P., & Srihari, K., 'Reliability of Lead-Free Alloys - A Review', Reliability and Maintainability Conference, Seattle, Washington, January 2002, pp. 423-428.
  42. Vaithianathasamy, S., Lam, S.S.Y., & Srihari, K., 'Yield Modeling in Electronics Manufacturing Using a Hybrid System of Neural Networks and Genetic Algorithms', Proceedings - ANNIE 2001, Rolla, Missouri, November 2001.
  43. Palaparthi, S., Lam, S.S.Y., Srihari, K., & Warheit, D., 'An Heuristic Approach for Throughput Optimization of SMT Placement Machines', Proceedings - ANNIE 2001, Rolla, Missouri, November 2001.
  44. Gnanasambandam, S., Primavera, A.A., & Srihari, K., 'An Adaptive Expert System for the Reliability Prediction of Electronic Packages', 29th International Conference on Computers and Industrial Engineering, Montreal, Canada, November 2001, pp.243-248.
  45. Mun, J.H. & Srihari, K., 'Process Mapping as a Vital Tool for Capacity Requirements Planning in an Electronics Manufacturing Environment', 29th International Conference on Computers and Industrial Engineering, Montreal, Canada, November 2001, pp.123-128.
  46. Patel, P., Primavera, A., & Srihari, K, 'Assembly and Reliability of a Wafer Level CSP', Proceedings - IMAPS International Symposium on Microelectronics, Baltimore, Maryland, October 2001, pp. 89-94.
  47. Balasubramanian, S., DiPietro, M., & Srihari, K., 'Feeder Inventory Management in a Contract Electronics Manufacturing Environment', Proceedings - FAIM 2001, Dublin, Ireland, July 2001, pp.318-326.
  48. Vithlani, P., & Srihari, K., 'Estimation of Standard Times in a High Volume Medium Mix Electronics Environment', Proceedings - FAIM 2001, Dublin, Ireland, July 2001, pp. 593-602.
  49. Huang, C-Y, Lee, P., & Srihari, K., 'Simulation Modeling for the Accuracy of Placement of Electronic Devices', Proceedings - 5th Annual International Conference on Industrial Engineering Theory, Applications and Practice, Hsinchu, Taiwan, December 2000 (CD-ROM).
  50. Pochareddy, S., Vasudevan, M., Srihari, K., & DiLella, J., 'Prediction and Control of Hole-Fill and Evaluation of Novel Stencil Aperture Shapes for the Pin-in-Paste Process', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
  51. Huang, C-Y, Srihari, K., Borgesen, P., 'A Study of Defects in the Flip Chip Encapsulation Process', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
  52. Greene, C., Srihari, K., & DiLella, J., 'An Experimental Evaluation of the Self-Centering of Active Devices', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
  53. Tonapi, S.S., & Srihari, K., 'Process Development and Implementation for a Contract Printed Circuit Board Assembly Environment', Proceedings - 4th Annual International Conference on Industrial Engineering Theory, Applications and Practice, San Antonio, Texas, November 1999 (CD-ROM).
  54. Huang, C.Y., Srihari, K., & Borgesen, P., 'The Optimization of Underfill Dispensing Process in Flip Chip Assembly', Proceedings - 4th Annual International Conference on Industrial Engineering Theory, Applications and Practice, San Antonio, Texas, November 1999 (CD-ROM).
  55. Tonapi, S.S., Srihari, K., Serafini, J., & Testani, M., 'Implementation of the Pin-In-Paste Process in a Contract Assembly Environment', Proceedings - 15th International Conference on Production Research, Limerick, Ireland, August 1999, pp. 1211-1214 (CD-ROM).
  56. Ramakrishnan, S., Srihari, K., & Westby, G.R., 'Decision Support for the AART Process', Proceedings 每 FAIM '99, Tilburg, The Netherlands, June 1999, pp. 1009-1020.
  57. Prasad, S., Srihari, K., DiLella, J., & Adriance, J.H., 'Optimization of the Stencil Printing of Adhesives Using a Plastic Stencil', FAIM '99, Tilburg, The Netherlands, June 1999, pp. 1021-1032.
  58. Gopalakrishnan, L., Srihari, K., & Westby, G.R., 'A Comprehensive Cost Model for the 'AART' Process', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
  59. Huang, C-Y, Srihari, K., & Borgesen, P., 'An Experimental Approach to 'Optimize' Preheat Temperature in Flip Chip Assembly', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
  60. Yang, C-J, Srihari, K., & DiLella, J., 'Optimization of Solder Paste Deposition for Ultrafine Pitch Surface Mount Devices', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
  61. Santos, D.L., Srihari, K., Yingling, M., Kenyon, B., & Orzel, R., 'Qualification Tests for TAB Package Assembly', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
  62. Greene, C., Srihari, K., & DiLella, J., 'Reduction of Post-Placement Defects in Surface Mount Assembly', Proceedings - 8th International Conference on Flexible Automation and Intelligent Manufacturing, Portland, Oregon, July 1998, pp. 333-344.
  63. Gopalakrishnan, L. & Srihari, K. 'Process Planning for Area Array Component Assembly', Proceedings - 8th International Conference on Flexible Automation and Intelligent Manufacturing, Portland, Oregon, July 1998, pp. 321-332.
  64. Murthy, S.T., Manessis, D., Srihari, K., & Westby, G.R., 'A Study of Solder Paste Rheology for the Alternate Assembly and Reflow Technology (AART) Process', MRS Spring Meeting 1998, San Francisco, California, May 1998.
  65. Hinerman, J., Srihari, K., & Westby, G.R., 'AART Process Development and Improvement Through Designed Experiments', Proceedings - Second Annual International Conference on Industrial Engineering Applications and Practice, Vol. 2, San Diego, California, 1997, pp. 621-626.
  66. Madson, R., Srihari, K., & Westby, G.R., 'Yield Modeling for the AART Process', Proceedings - Second Annual International Conference on Industrial Engineering Applications and Practice, Vol. 2, San Diego, California, 1997, pp. 1325-1330.
  67. Chu, H.C., Srihari, K., & Emerson, C.R., 'A Distributed Artificial Intelligence Based Framework for Process Planning in Surface Mount PWB Assembly', Proceedings - First Annual International Conference on Industrial Engineering Applications and Practice, Houston, Texas, December 1996, pp. 83-88.
  68. Shih, W., Srihari, K., & Emerson, C.R., 'Manufacturing Systems Control in Printed Wiring Board Assembly Using Distributed Artificial Intelligence', Proceedings - Fifth Industrial Engineering Research Conference, Minneapolis, Minnesota, 1996, pp. 97-102.
  69. Su, Y., & Srihari, K., 'A Decision Support Framework for PWB Assembly', Proceedings - Third International Conference on Computer Integrated Manufacturing, Vol. 1, Singapore, July 1995, pp. 653-662.
  70. Wu, C.H., & Srihari, K., 'Automated Knowledge Acquisition for the Surface Mount PWB Assembly Domain', Proceedings - Third International Conference on Computer Integrated Manufacturing, Vol. 2, Singapore, July 1995, pp. 1408-1415.
  71. Liu, C.Y., Emerson, C.R., & Srihari, K., 'A Multi-Criteria Decision Support System for Placement Machine Selection', ASME International Electronic Packaging Conference, Binghamton, New York, September 1993, pp. 381-387.
  72. Huang, Y.W., Srihari, K., Adriance, J., & Westby, G., 'A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem', ASME International Electronic Packaging Conference, Binghamton, New York, September 1993, pp. 373-379.
  73. Krishnan. S., Srihari, K., & Emerson, C.R., 'An Integrated Design for Manufacturing Environment for Surface Mount PCB Assembly', Second Industrial Engineering Research Conference, International Industrial Engineering Conference, Los Angeles, California, May 1993, pp. 832-836.
  74. Krishnan. S., Hwang, Y., & Srihari, K., 'A DFM Framework for Surface Mount PCB Assembly', International Conference of Technology Management '93, Denver, Colorado, April 1993, pp. 207-217.
  75. Srihari, K., & Emerson, C.R., 'Knowledge Based Design for Manufacturing in Surface Mount PCB Assembly', Manufacturing Aspects in Electronics Packaging, ASME Winter Annual Meeting, EEP-Vol.2/PED-Vol.60, Anaheim, California, November 1992, pp.7-13.
  76. Srihari, K., Masood, A., & Cala, M., 'A Prototype Expert CAPP System Dealing with Uncertainty', Proceedings - Manufacturing International '90, Vol. 1, Atlanta, Georgia, March 1990, pp. 67-72.
  77. Srihari, K., Cecil, J.A., & Emerson, C.R., 'An Application of Petri Nets in FMS Modeling, Analysis, and Control', Proceedings - Manufacturing International '90, Vol. 2, Atlanta, Georgia, March 1990, pp. 107-112.

Publications In Conference Proceedings (In Reverse Chronological Order)

  1. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'Flux Spatter Evaluation Using Lead-Free Solder Pastes', IPC/JEDEC Conference, San Jose, California, April 2005.
  2. Sathyanarayanan, P., Grebe, V., Murcko, R., & Srihari, K., 'Defect Tracking and Yield Enhancements Through Improved Data Collection Systems in an Electronics Manufacturing Environment', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  3. Ramakrishnan, S., Kayande, S., Murcko, R., & Srihari, K., 'Information Design Processes for Electronics Manufacturing Systems', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  4. Nagarkar, K., Murcko, R., & Srihari, K., 'Integration of QFD and DOE Methodologies for New Product Introduction in the Electronics Manufacturing Arena', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  5. Gowda, A., Esler, D., Tonapi, S., Srihari, K., & Zhong, A., 'Effect of Assembly Process Conditions on System-Level Performance of Thermal Interface Materials', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  6. Nagarkar, K. & Srihari, K., 'Integration of QFD and DOE Methodologies for New Product Introduction in the Electronics Manufacturing Arena', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  7. Chaware, R., Vichare, N., Borgesen, P., Blass, D., & Srihari, K., 'Accelerated Testing of Flip Chip Underfills and the Effect of Moisture and Temperature on the Aging of Underfills', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
  8. Gowda, A., Greenfield, P., Srihari, K., & Sammakia, B.G., 'Structural Finite Elemental Modeling of a Multilayered Plated Through-Hole 每 Effect of Material Properties', Pan Pacific Conference, Oahu, Hawaii, February 2004, pp.145-151.
  9. Sivakumar, K., Srihari, K., Warheit, D., & Gowda, A., 'Tactical Production Planning for Printed Circuit Board Assembly', Pan Pacific Conference, Oahu, Hawaii, February 2004, pp.221-229.
  10. Bruno, F., Granno, F., O'Keeffe, E., & Srihari, K., 'Solder Joint Evaluation of Mixed-Alloy Assemblies', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
  11. Gopalakrishnan, V., Anson, S., Venkataraman, V., Murcko, R., & Srihari, K., 'Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
  12. Janakiraman, S., Murcko, R., Srihari, K., Anson, S., & Holton, J., 'Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
  13. Mukadam, M., Meilunas, M., Borgesen, P., & Srihari, K., 'Assembly and Reliability Issues Associated with Leadless Chip Scale Packages', Proceedings 每 IMAPS Conference, Boston, Massachusetts, November 2003 (CD-ROM).
  14. Gowda, A., Zhong, A., Esler, D., David, J., Tonapi, S.S., Schattenmann, F., and Srihari, K., 'In-Situ Performance of Silicone Thermal Interface Materials 每 Influence of Filler Characteristics', Proceedings - Polytronic 2003, Switzerland, October 2003, pp. 177-182.
  15. Ramakrishnan, S., Kawli, V., & Srihari, K., 'A Simulation Based Control Architecture for Electronics Manufacturing Processes', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.487-493.
  16. Vellore, T., Craik, J., & Srihari, K., 'Implementation of SQC Techniques for Closed Loop Process Control in Electronics Manufacturing', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.524-529.
  17. Kawli, V., Warheit, D., & Srihari, K., 'A Study of the Accuracy of Component Placement Simulation in Electronics Manufacturing', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.138-143.
  18. Kayande, S., Adriance, J., Coleman, W.E., & Srihari, K., 'Solder Paste Stencil Printing Performance Based on Stencil and Solder Technology', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.1-5.
  19. Pradhan, S., Balasubramanian, S., Mazloom, M., Arbulich, J., & Srihari, K., 'Cycle Time and Variability Reduction in an Optical Assembly Process', Proceedings - IEMT 2003, San Jose, California, July 2003 (CD-ROM).
  20. Prabhakumar, A., Zhong, A., Tonapi, S.S., Sherman, D., Cole, H., Schattenmann, F., & Srihari, K., 'A Comparison of the Adhesion Strength of Epoxy and Silicone Based Thermal Interface Materials', Proceedings - ECTC 2003, New Orleans, Louisiana, May 2003, pp.1809-1814.
  21. Saiyed, S., Nagarur, N., & Srihari, K., 'Simulation Analysis of an Electronics Assembly Line Controlled by MRP and CONWIP Concepts', Proceedings - Industrial Engineering Research Conference, Portland, Oregon, May 2003 (CD-ROM).
  22. Wable, G., Chu, Q., Damodaran, P., Verbeist, P., & Srihari, K., 'A Comparison of Lead-Free Solder Pastes with No-Clean and Water-Soluble Flux Chemistries', Proceedings - IPC/JEDEC Lead Free Conference, San Jose, California, April 2003.
  23. Jadhav, H., Murcko, R., Brinthaupt, M., Testani, M., & Srihari, K., 'Automated Design Verification Using DFM/DFT', APEX 2003, Anaheim, California, March 2003, pp. S08-2-1 to S08-2-7.
  24. Gnanasambandam, N., Murcko, R., Grebe, V., Testani, M., & Srihari, K., 'Using Heuristics to Identify Maverick Lots at In-Circuit Test', APEX 2003, Anaheim, California, March 2003, pp. S39-3-1 to S39-3-7.
  25. Manjeshwar, P., Craik, J., Phadnis, S.S., & Srihari, K., 'Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High-Volume Low-Mix SMT Line', APEX 2003, Anaheim, California, March 2003, pp.S30-1-1 to S30-1-9.
  26. Poyapakkam, V., Borgesen, P., & Srihari, K., 'Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation', APEX 2003, Anaheim, California, March 2003, pp. S10-2-1 每 S10-2-5.
  27. Manjeshwar, P., Shaharwalla, S., Phadnis, S., Craik, J., & Srihari, K., 'A Six-Sigma Approach to Solder Paste Deposition for PCB Assembly', Pan Pacific Microelectronics Symposium, Kauii, Hawaii, February 2003, pp. 49-54.
  28. Patel, J., Phadnis, S., Jusufagic, F., & Srihari, K., 'Failure Modes and Effects Analysis for Electronics Manufacturing', Pan Pacific Microelectronics Symposium, Kauii, Hawaii, February 2003, pp.171-177.
  29. Pradhan, S., Arbulich, J., O'Keeffe, E., & Srihari, K., 'Evaluation of Fusion Splicers for High Strength Splicing', Proceedings - SMTA NEPCON West, San Jose, California, December 2002 (CD-ROM).
  30. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Industrial Engineering and Continuous Improvement in Health Care', 10th Annual Clinical Campus Research Session, Upstate Medical Center, Binghamton, New York, November 2002.
  31. Manjeshwar, P.K., Shaherwalla, S., Craik, J., Kirby, S., Phadnis, S., & Srihari, K., 'Qualification of Three Dimensional Solder Paste Inspection Systems for Effective In-Line Process Control', Proceedings - SMTA International, Chicago, Illinois, September 2002, pp.650-658.
  32. Vellore, T.K., Craik, J., & Srihari, K.., 'Implementing Integrated Predictive Manufacturing at an EMS Provider 每 A Continuous Improvement Approach', Proceedings - SMTA International, Chicago, Illinois, September 2002, pp.687-695.
  33. Bahl, S., Venkatesh, R.S., Craik, J., Bedi, R., Uriarte, H., & Srihari, K., 'Requirement Specifications for an Enterprise Level Collaborative Data Collection and Quality Management Tool for an EMS Provider', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp. 140-148.
  34. Balasubramanian, S., Arbulich, J., Craik, J., & Srihari, K. 'Decision Support for Test and Debug Areas in RF Manufacturing', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp. 136-139.
  35. Patwardhan, V., Blass, P., Borgesen, P., & Srihari, K., 'Reliability Issues in Direct Chip Attach Assemblies Using Reflow or No-Flow Underfills', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp.73-77.
  36. Gowda, A., Primavera, A., Rampurawala, M., & Srihari, K, 'Rework and Reliability of Underfilled CSP Assemblies', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
  37. Sammakia, B., & Srihari, K, 'Industry 每 University Partnership in Graduate Research and Education', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
  38. Pradhan, S., Mazloom, A., Arbulich, J., & Srihari, K., 'Minimization of the Splice Loss between a Single Mode Fiber and an Erbium Doped Fiber', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
  39. Joshi, J., Marquez, U., Primavera, A., & Srihari, K., 'Reliability Evaluation of High Density Microvia Structures', Proceedings - ICAPS 2002, Reno, Nevada, March 2002 (CD-ROM).
  40. Tarhalkar, A., & Srihari, K, 'Product Cost Estimation Using Activity Based Costing', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp. 201-206.
  41. Gowda, A., Primavera, A., & Srihari, K, 'Challenges in Lead-Free Rework', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.365-374.
  42. Diwe, P., Kini, N., Iyer, R., & Srihari, K, 'Capacity Requirements Planning in a High Volume, Medium/High Mix EMS Provider's Environment', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.214-219.
  43. Rampurawala, M., Meilunas, M., Gowda, A., and Srihari, K., 'Mechanical Reliability of Underfilled CSP Assemblies', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.266-272.
  44. Gowda, A., Primavera, A.A., & Srihari, K., 'Rework of Lead-Free Surface Mount Components', Proceedings - APEX 2002, San Diego, California, January 2002, pp.S05-3-1 S05-3-10.
  45. Mun, J.H., Prats, A., Borgesen, P., & Srihari, K., 'Assembly Process Issues in Integrating Commercial Reflow Encapsulants into Flip Chip Assembly', Proceedings - EMAP 2001, Cheju Island, Korea, November 2001.
  46. Mahalingam, S., Mun, J.H., Prats, A., Blass, D., & Srihari, K., 'Fluxing for Flip Chip Assembly - Effect of Bump Damage', Proceedings - EMAP 2001, Cheju Island, Korea, November 2001.
  47. Pradhan, S, Balasubramanian, S, Arbulich, J, & Srihari, K, 'Implementation of Fiber Optics Assembly in a Contract Manufacturing Facility', Proceedings - SMTA Optoelectronics and Telecom Revolution Conference, Dallas, Texas, November 2001, pp.27-34.
  48. Srihari, K., Santos, D., & Sammakia, B.G., 'Industry-University Partnership: The Binghamton Model', Proceedings - SMTA International Conference, Chicago, Illinois, September 2001, pp. 672-675.
  49. Zhou, X, Ladhar, H., Gopalan, B., & Srihari, K., 'Quantifying the Effects of the factors that Influence Yield in an EMS Environment', Proceedings - SMTA International Conference, Chicago, Illinois, September 2001, pp.683-689.
  50. Srihari, K., 'Industry-University Partnership in Graduate Research and Education', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.25-28.
  51. Arslan, N., Ramakrishnan, S., & Srihari, K., 'An Intelligent Agent Based System for ECO Management in an Electronics Manufacturing Environment', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.246-251.
  52. Srihari, K., & Vichare, N., ' Supply Chain Management for Electronics Manufacturing - Challenges and Solutions', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.93-98.
  53. Gowda, A., Primavera, A., Srihari, K., 'Lead Free Rework Process for Chip Scale Packages', Proceedings - Advanced Packaging Technologies in the Electronics Industry Conference, Boston, Massachusetts, June 2001, pp. 99-106.
  54. Gowda, A., Murcko, R., Srihari, K., Anglin, C., & Serafini, J., 'Implementing Ball Grid Arrays in an Electronics Manufacturing Service Provider's Environment', Proceedings - Advanced Packaging Technologies in the Electronics Industry Conference, Boston, Massachusetts, June 2001, pp. 135-142.
  55. Vaithianathasamy, S., Lam, S.S.Y., & Srihari, K., 'Process Yield Prediction for an EMS Provider Using Neural Network Models', Proceedings - 10th Industrial Engineering Research Conference, Dallas, Texas, May 2001 (CD-ROM).
  56. Tonapi, S.S., Sathe, S., Srihari, K., & Sammakia, B., 'Parametric Studies of the Thermal Performance of Back-to-Back Tape Ball Grid Array Packages', Proceedings - ECTC 2001, Orlando, Florida, May 2001 (CD-ROM).
  57. Tonapi, S.S., Borgesen, P., & Srihari, K., 'No-Pb Flip Chip Assembly - Issues and Challenges', Proceedings - ECTC 2001, Orlando, Florida, May 2001 (CD-ROM).
  58. Joshi, J., Primavera, A., & Srihari, K., 'The Proximity of Microvias to PTH's and Its Impact on the Reliability of these Microvias', Proceedings - IPC Expo, Anaheim, California, March 2001, pp.S14-1-1 - S14-1-9).
  59. Pochareddy, S., Srihari, K., Satagopan, S.S., & Economou, M., 'Impedance and Propagation Delay Characterization for FR-4 Printed Circuit Boards', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 314-319.
  60. Alawani, A., Srihari, K., & DiLella, J., 'Experimental Techniques to Develop a Robust Stencil Printing Process for Diverse Interconnection Technologies', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 416-428.
  61. Vijayamadhavan, K., Kini, N., Srihari, K., & Iyer, R., 'Systematic Analysis Towards the Minimization/Elimination of Flux Spatter on Gold Finger Contacts', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 515-520.
  62. Chouta, P., Santos, D., Srihari, K., Sammakia, B., DiPietro, M., & Andros, F., 'A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 11-28.
  63. Ladhar, H., Rao, S., Yee, S., Hyland, K., Zhou, X., Gopalan, B., & Srihari, K., 'Yield Estimation in an EMS Environment', Proceedings - APEX 2001, San Diego, California, January 2001, pp. SM6-1 1 - SM6-1 7.
  64. Tonapi, S., Borgesen, P., Srihari, K., 'Effect of Flux and Reflow Parameters on the Soldering of Lead-Free Flip Chips', Proceedings - APEX 2001, San Diego, California, January 2001, pp. AT5-2 1 - AT5 -2 7.
  65. Venkatesh, R.S., Mazloom, A., Srihari, K., Kamath, S., & Craik, J., 'Solder Paste Evaluation for Lead Free Assembly', Proceedings - APEX 2001, San Diego, California, January 2001, pp. LF1-6 1 - LF6-1 9.
  66. Tonapi, S.S., Sathe, S., Srihari, K., & Sammakia, B., 'Parametric Studies on the Thermal Performance of a Tape Ball Grid Array (TBGA) Package', Symposium on Electronics Manufacturing, ASME International Mechanical Engineering Conference and Exposition, Orlando, Florida, November 2000, pp.425-431.
  67. Mohammad, Y., Srihari, K., Primevera, A., Pitarresi, J., 'Effect of Voids on the Reliability of BGA/CSP Solder Joints', Proceedings - International Electronics Manufacturing Technology Symposium, Santa Clara, California, October 2000, pp. 207-213.
  68. Schake, J., Srihari, K., & Borgesen, P., 'Stencil Design Improvement for Bumping Wafers By Printing Solder Paste', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 177-185.
  69. Limaye, A., Srihari, K., & DiLella, J., 'Rework of Mirror Imaged Area Array Assemblies', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 301-309.
  70. Pochareddy, S., Srihari, K., Gopalakrishnan, L., & Sion, V., 'Prediction of PCB Thickness for Selection of a Suitable PCB Manufacturing Technology', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 656-663.
  71. Greene, C., Srihari, K., & DiLella, J., 'Optimizing the Stencil Printing of Lead Free Pastes Using Designed Experiments', Proceedings - SMTA Lead Free Symposium, Boston, Massachusetts, June 2000, pp. 108-114.
  72. Lin, C., Hayes, S., Srivastava, R., & Srihari, K., 'Rework of BGAs Used in Data Networking Applications', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P-EQ3/2-1 - P-EQ3/2-6.
  73. Borgesen, P., Blass, D., & Srihari, K., 'Flip Chip Reliability', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P_AP4/2-1 - P-AP4/2-8.
  74. Gopalan, B., Srihari, K, & Adriance, J.H., 'Systematic Procedures for the Process Evaluation of Solder Pastes', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P-SM1/3-1-P_SM1/3-6.
  75. Tonapi, S.S. & Srihari, K., 'Process Optimization Using Designed Experiments in an EMS Provider's Environment', Proceedings - Fifth Annual Pan Pacific Microelectronics Symposium, Maui, Hawaii, January 2000, pp. 375-380.
  76. Hinerman, J.B., Srihari, K., & Westby, G.R., 'The Pin-In-Paste (or AART) Process for Odd-Form and Through Hole Printed Circuit Boards', Proceedings - Fifth Annual Pan Pacific Microelectronics Symposium, Maui, Hawaii, January 2000, pp. 416-421.
  77. Ramakrishnan, S., Srihari, K., Egan, R.P., & Davern, J., 'Procurement Lead Time Reduction at a Contract Assembly Facility Through an Intelligent Agent Based Framework', Proceedings- Contract Manufacturing Symposium, SMTA International, San Jose, California, September 1999, pp. 16-22.
  78. Hete, A., Srihari, K., & Frisbie, R., 'Enhancing Quality in Electronics Assembly through Data Acquisition', Proceedings - Contract Manufacturing Symposium, SMTA International, San Jose, California, September 1999, pp. 583-588.
  79. Alawani, A., Yang, C-J, Srihari, K., & DiLella, J., 'Incorporating BGAs and CSPs in a High Volume Contract Manufacturing Environment', Proceedings - IPC Chip Scale and BGA National Symposium, Vol. 2, Santa Clara, California, May 1999, pp. 33-43.
  80. Satagopan, S.S., Srihari, K., & DiLella, J., 'Adhesive Printing - A Taguchi Based Approach for Process Development', Proceedings - IPC Printed Circuits Expo, Long Beach, California, March 1999, pp. S10-3-1 - S10-3-4.
  81. Santos, D.L. & Srihari, K., 'Using Computer Aided Cost Estimation for Printed Circuit Board Design and Assembly: A Review of Recent Work', Proceedings - NEPCON West 1999, Anaheim, California, February 1999.
  82. Seeniraj, R., Manessis, D., Srihari, K., & Westby, G.R., 'A Comprehensive Evaluation of the Strength of AART Solder Joints', Proceedings - 23rd IEEE/CPMT International Electronics Manufacturing Symposium, Austin, Texas, October 1998, pp. 76-85.
  83. Putcha, U., Jayaraman, S., Srihari, K., Hazar, A., & Sanyshyn, J., 'Digital Simulation as an Aid to Production Planning for a Contract Manufacturing Environment', Proceedings - IPC/SMTA Electronics Assembly Conference, Providence, Rhode Island, October 1998, pp. S14-2-1-S14-2-5.
  84. Primavera, A., Sturm, R., Prasad, S., & Srihari, K., 'Factors that Affect Void Formation in BGA Assembly', Proceedings - IPC/SMTA Electronics Assembly Conference, Providence, Rhode Island, October 1998, pp. S2-2-1-S2-2-7.
  85. Seeniraj, R., Manessis, D., Srihari, K., & Westby, G.R., 'Reliability Study of Through Hole Solder Joints Processed via Alternative Assembly and Reflow Technology', Proceedings - Surface Mount International, San Jose, California, August 1998, pp. 453-458.
  86. Primavera, A. A., Chung, C-W, & Srihari, K., 'Factors that Influence the Process, Yield, and Reliability Obtained During BGA Rework', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 51-61.
  87. Chung, C-W, Srihari, K., & Primavera, A., 'Nozzle Design and System Characterization for the Rework of BGAs', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 37-42.
  88. Gopalakrishnan, L., Srihari, K., 'Design and Implementation of an Assembly Process for BGAs Using Designed Experiments', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 9-15.
  89. Gopalakrishnan, L., Ranjan, M., Srihari, K., & Woychik, C., 'Encapsulant Materials for Flip Chip Assembly', Proceedings - ECTC Conference, Seattle, Washington, May 1998, pp. 1291-1297.
  90. Ranjan, M., Gopalakrishnan, G., Srihari, K., & Woychik, C., 'Die Cracking in Flip Chip Assemblies', Proceeding - ECTC Conference, Seattle, Washington, May 1998, pp. 729-733.
  91. Venkateswaran, S., Srihari, K., Adriance, J.H. & Westby, G.R., 'A Realtime Process Control System for Solder Paste Stencil Printing', Proceedings - International Electronics Manufacturing Technology Symposium, Austin, Texas, October 1997, pp. 62-67.
  92. Huang, Y-W, Srihari, K., & Primavera, A., 'Critical Issues that Influence the BGA Assembly Process', Proceedings - NEPCON Asia, Singapore, September 1997.
  93. Hinerman, J., Srihari, K., & Westby, G.R., 'Alternate Assembly and Reflow Technology for Odd Form and Through Hole PCBs', Proceedings - NEPCON Asia, Singapore, September 1997.
  94. Huang, Y-W, Srihari, K., & Primavera, A., 'Some Factors that Could Impact the BGA Assembly Process', Proceedings - IPC/SMTA BGA Symposium, Bedford, Massachusetts, June 1997, pp. 67-76.
  95. Fillo, J., Sahay, C., & Srihari, K., 'Video Based Packaging Course', Proceedings - 44th ECTC Conference, San Jose, California, May 1997.
  96. Nagarajan, K., Santos, D., & Srihari, K., 'CACE - A Computer Aided Cost Estimation System for Area Array Devices', Proceedings - International Electronics Packaging Conference, Austin, Texas, October 1996, pp. 457-467.
  97. Huang, C.Y., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'The Wetting Balance in the Solderability Evaluation of Surface Mount Components', Proceedings - First Pan Pacific Microelectronics Symposium, Honolulu, Hawaii, 1996, pp. 187-194.
  98. Huang, C-Y, Srihari, K., McLenaghan, A.J., & Westby, G.R., 'Flux Activity Evaluation Using the Wetting Balance', Proceedings - 17th IEEE/CPMT Electronics Manufacturing Technology Symposium, Austin, Texas, 1995, pp. 344-350.
  99. Thomas, S., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'Measurement of Solder Paste Component Retention Properties', Proceedings - 17th IEEE/CPMT Electronics Manufacturing Technology Symposium, Austin, Texas, 1995, pp. 351-360.
  100. Venkatestwaran, S., Srihari, K., Adriance, J.H., & Westby, G.R., 'A Software System for the Process Control and Trouble Shooting of Solder Paste Stencil Printing', Proceedings - Surface Mount International, San Jose, California, 1995, pp. 713-719.
  101. Thomas, S., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'The Measurement of Component Retention Properties of Solder Paste for Surface Mount PWB Assembly', Proceedings - Surface Mount International, San Jose, California, 1995, pp. 720-725.
  102. Chung, C.W., Srihari, K., Adriance, J.H., and Westby, G.R., 'A Process Control System for Solder Paste Stencil Printing', Proceedings - International Electronics Packaging Conference, Atlanta, Georgia, 1994, pp. 867-874.
  103. Chung, C.W., Srihari, K., Adriance, J.H., & Westby, G., 'Closed Loop Control for Solder Paste Stencil Printing', Proceedings - Surface Mount International, San Jose, California, September 1994, pp. 485-491.
  104. Alexander, M., Srihari, K., & Emerson, C.R., 'Manufacturing Cost Analysis of Surface Mount PCB Designs', Proceedings - International Electronics Packaging Society Conference, San Diego, California, September 1993, pp. 1039-1049.
  105. Alexander, M., Srihari, K., & Emerson, C.R., 'Cost Based Surface Mount PCB Design Evaluation', Proceedings - Second International Workshop on the Economics of Design, Test, and Manufacturing, Austin, Texas, May 1993.
  106. Huang, Y.W., Srihari, K., Adriance, J., & Westby, G.R., 'Heuristic Based Multiple Batch Placement Sequence Optimization', Proceedings - NEPCON West 1993, Anaheim, California, 1993, Vol. 3, pp. 1598-1607.
  107. Wu, C.H., Srihari, K., & McLenaghan, A.J., 'Knowledge Based Decision Support for Surface Mount Infrared Reflow Soldering', Thirteenth IEEE/CHMT International Electronics Manufacturing Symposium, Baltimore, Maryland, September 1992, pp. 316-320.
  108. Ugur, H., & Srihari, K., 'An Integrated Expert System Environment for DFM in Surface Mount PCB Assembly', Thirteenth IEEE/CHMT International Electronics Manufacturing Symposium, Baltimore, Maryland, September 1992, pp. 85-89.
  109. Shih, W., Srihari, K., Adriance, J., Westby, G.R., 'A Heuristic Approach to Placement Sequence Identification for SMT', International Electronic Packaging Society Conference, Austin, Texas, September 1992, pp. 631-644.
  110. Srihari, K., & Emerson, C.R., 'Knowledge Based Manufacturing Problem Diagnosis in PCB Assembly', International Electronic Packaging Society Conference, Austin, Texas, September 1992, pp. 245-257.
  111. Shih, W., Srihari, K., & Adriance, J., 'An Expert System Approach to Placement Sequence Identification for SMT', Proceedings - SMTCON '92, Secaucus, New Jersey, April 1992, pp. 129-138.
  112. Srihari, K., & Westby, G.R., 'Decision Support for PCB Assembly Using Knowledge Based Expert Systems', Proceedings - NEPCON West 1992, Anaheim, California, February 1992, pp. 545-554.
  113. Maria, A., Srihari, K., Emerson, C.R., & Westby, G.R., 'An Expert System Solder Paste Selection Advisor', Proceedings - NEPCON West 1992, Anaheim, California, February 1992, pp. 555-564.
  114. Srihari, K., Emerson, C.R., & Westby, G., 'Problem Solving in the PCB Assembly Domain Using Expert Systems', Proceedings - SMTCON West, San Diego, California, November 1991, pp. 237-246.
  115. Cala, M., & Srihari, K., 'Knowledge Based Process Planning for Surface Mount Technology', Proceedings - Eleventh IEEE/CHMT Electronics Manufacturing Technology Symposium, San Francisco, California, September 1991, pp. 235-239.
  116. Cecil, J.A., Srihari, K., & Emerson, C.R., 'Realtime Process Planning for PCB Assembly', Proceedings - Eleventh IEEE Electronics Manufacturing Technology Symposium, San Francisco, California, Sept. 1991, pp. 240-243.
  117. Derebail, A., Srihari, K., & Westby, G.R, 'Knowledge Based Adhesive Selection for SMT Assemblies', Proceedings - International Electronic Packaging Society Conference, Vol.2, San Diego, California, September 1991, pp. 1024-1035.
  118. Srihari, K., & Westby, G.R., 'Expert Systems Development for PCB Assembly Using SMT', Proceedings - SMTCON '91, Atlantic City, New Jersey, April 1991, pp. 101-109.
  119. Srihari, K., 'An Expert System Based Concurrent Engineering Approach to PCB Assembly', Proceedings - Fifth International Conference on CAD/CAM, Robotics, and Factories of the Future, Norfolk, Virginia, December 1990, pp. 355-360.
  120. Derebail, A., Srihari, K., & Emerson, C.R., 'A Knowledge Based System for the Selection of Adhesives for PCB Assembly', Proceedings - IEEE International Engineering Management Conference, Santa Clara, California, October 1990, pp. 251-257.
  121. Srihari, K., & Emerson, C.R., 'Uncertainty Management in Process Planning for PCB Assembly', Proceedings - Ninth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Washington D.C., October 1990, pp. 290-296.
  122. Cala, M., & Srihari, K., 'Artificial Intelligence in Printed Circuit Board Assembly Operations', Proceedings - 1990 International Industrial Engineering Conference, San Francisco, California, May 1990, pp. 563-568.
  123. Masood, A., & Srihari, K., 'Uncertainty Management in Computer Aided Process Planning Systems', Proceedings - International Industrial Engineering Conference, San Francisco, California, May 1990, pp. 39-44.
  124. Emerson, C.R., & Srihari, K., 'CIM Means People', Proceedings IIE Integrated Systems Conference, Atlanta, Georgia, November 1989, pp. 211 216.
  125. Srihari, K., & Greene, T.J., 'Prototype Macro CAPP System Development for FMS Cells', Proceedings Xth International Conference on Production Research, Nottingham, England, August 1989.
  126. Cala, M., & Srihari, K., 'Computer Aided Process Planning for Printed Circuit Board Assembly', Proceedings Xth International Conference on Production Research, Nottingham, England, August 1989.
  127. Srihari, K., & Greene, T.J., 'Computer Aided Process Planning (CAPP) Implementation in a FMS', Proceedings International Industrial Engineering Conference, Orlando, Florida, May 1988, pp. 519 524.
  128. Srihari, K., & Deisenroth, M.P., 'Robot Programming Languages A State of the Art Survey', Proceedings Second International Conference on Robotics and Factories of the Future, San Diego, California, July 1987, pp. 625 635.
  129. Srihari, K., & Greene, T.J., 'An Evaluation and Review of Computer Aided Process Planning Systems', Proceedings World Productivity Forum & 1987 International Industrial Engineering Conference, Washington D.C., May 1987, pp. 438 444.
  130. Srihari, K., & Greene, T.J., 'Job Release Methods in a Manufacturing Environment', Proceedings World Productivity Forum & 1987 International Industrial Engineering Conference, Washington D.C., May 1987, pp. 519 524.

Conference Papers To Be Presented

  1. Gowda, A., Zhong, A., Tonapi, S.S., Nagarkar, K., & Srihari, K., 'Thermal and Mechanical Properties of Silicone Thermal Interface Materials with Varying Cross Linking Densities', InterPACK 2005, San Francisco, CA, July 2005.
  2. Manjeshwar, P., Castro, M., Damodaran, P., Craik, J., & Srihari, K., 'Stencil Printing and Reflow Parameter Optimization During the Assembly of 0201 Components', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  3. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'A Repeatable and Reliable Process For Lead-Free Fine Pitch BGAs', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  4. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'Minimizing Flux Residues on the Component Body', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  5. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'A Repeatable and Reliable Process For Lead-Free Fine Pitch BGAs', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  6. Venkataraman, V., Tran, S., Vincent, M., Murcko, R. & Srihari, K., 'Flip Chip Underfill Selection: Issues with Moisture Absorption and Flux Residues', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  7. Venkataraman, V., Tran, S., Vincent, M., Murcko, R. & Srihari, K., 'Effect of Cleaning Process Parameters and Materials on Flux Residue for Flip Chip Assembly', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  8. Brewer, S., Nagarkar, K., Murcko, R. & Srihari, K., 'Effect of Cleaning Process Parameters and Materials on Flux Residue for Flip Chip Assembly', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  9. Sudarsanam, K., Gregory, P., Murcko, R. & Srihari, K., 'An Intelligent Systems Approach for Improved Panel Registration', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  10. Ramakrishnan, S., Parimoo, S., & Srihari, K., 'Strategic Considerations for the Implementation of an ERP System at an EMS Provider', SMTA Chicago 2005, Chicago, Illinois, September 2005.
  11. Saiyed, S., Sengupta, D., Murcko, R., & Srihari, K., 'Solder Short Failure Mechanism in System-in-Packages', IMAPS Chicago 2005, Chicago, Illinois, September 2005.
  12. Ramkumar Maniam, S. & Srihari, K., 'A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging', Proceedings 每 ASME IMECE, Orlando, Florida, November 2005.
  13. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGAs', Proceedings 每 ASME IMECE, Orlando, Florida, November 2005.
  14. Bruno, F., Abtew, M., Damodaran, P., & Srihari, K., 'Solder Joint Evaluation of Mixed Alloy Assemblies', Proceedings 每 ASME IMECE, Orlando, Florida, November 2005.
  15. Nagarkar, K., Borgesen, P., & Srihari, K., 'A Study on Optical Fiber Damage Due To Optoelectronic Assembly Processes', Proceedings 每 ASME IMECE, Orlando, Florida, November 2005.