Research at Flextronics International encompasses a gamut of areas germane to the electronics manufacturing domain. The research at this contract PCB house includes assembly process development relating to DCA, BGA and CSP components along with process development for assembly of fine pitch components. Process development by the group at Flextronics is performed on 'live' customer assemblies. The production facility houses ten full assembly lines complete with analytical and measurement equipment.
Development of Comprehensive Guidelines for Area Array and Fine Pitch Surface Mount
The objective of this project is to identify the process issues in Ball Grid Array (BGA)/Direct Chip Attach (DCA), Ultra Fine Pitch Technology (UFPT) and through-hole assembly, that must be resolved for an effective implementation of Surface Mount Technology. The initial part of the study involves the design and process optimization for a test vehicle with a mix of high I/O area array components (particularly BGAs), with chip sized packages like the micro-BGA. The knowledge obtained from these experiments would be subsequently used in designing a double-sided test vehicle, process development and validation to provide a comprehensive cookbook on the double-sided assembly process.
BGA Rework - Ji Hyon Mun
The project concentrates on the rework process specifically for BGA packages as a part of the New Product Implementation (NPI) system. This includes rework of BGAs on both single and double-sided boards. The BGAs that are currently and will be reworked on range from chip scale packages (CSPs) to super BGAs. It is a challenging project that will enhance the product implementation at DMNY.
Standard Settings at Dovatron International - Prashant Vithlani
The objective of the project is to set standards for all the equipments and the assembly line at Dovatron International. The equipments include General Placement Machine (GSM), High Speed Placement Machine (HSP), Stencil Printer, and Reflow/Wave Oven. The research focuses on conducting a micro-motion study to estimate the standard time of operation on all the equipments and on the assembly line. Further the factors that would affect the time performance of the equipment is identified to set the standard of the equipment.
Implementing Lean Manufacturing at Dovatron - Manikandan Munikrishnan & C.S.Kangaraj
The aim of Lean Manufacturing is to establish a system focused on continuous improvement and elimination of waste, which is based on specific techniques that are integrated into a logical and orderly process. The aim of this project is to reduce the waste occurring in materials at Dovatron Manufacturing, New York (DMNY), thereby producing a continuous flow of materials through DMNY. This will result in a reduction of the material lead times by reducing the amount of material handling and also help in reducing the inventory.
Technology Transfer Using CD-ROM - Sachin Phadnis
The project involves implementation of all decision support systems developed for Dovatron using a single platform. The project also involves creating a virtual library by providing soft copies of the reports submitted to Dovatron on the same platform. This is achieved by developing an interactive front end using DIRECTOR 7. The software developed establishes links to all the reports and softwares and also allows use of the .exe files of the softwares.
Research at Dovatron, started in 1994, takes a more production flavor with assembly process development being carried out on 'live' assemblies. The fact that Dovatron is a contract PCB assembly house, with a fairly large product mix, makes process development highly challenging. Research at Dovatron has focussed on a broad spectrum of areas of Electronics Manufacturing such as materials, process, design, software, etc.
The process related projects that have been successfully competed are listed below:
Process Research
- Solder Paste Testing and Evaluation ~ 1996 & 1997
- Adhesive Deposition (Dispensing and Printing) ~ 1996 - 1997
- No Clean Process ¡®Optimization¡¯ ~ 1997 - 1998
- Pin-in-Paste Implementation ~ 1997 - 1998
- Post Placement Defect Reduction ~ 1997
- Transition to No Clean Assembly ~ 1997 - 1998
- Underfill Characterization ~ 1998
Software Development
- Intelligent Agents for SMT ~ Printing, Pin-in-Paste, Underfill, etc.
- Information automation
CD Based Reporting Mechanism
Manufacturing Systems
- Computer Networking and MRP
- Vendor Product Acceptance and Incoming Inspection
Automation of
- Information Collection and Utilization
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