The team's activities in the area of development of processes for surface mount assembly started in the early 90's. Research was started in collaboration with the Surface Mount Laboratory attached to the Advanced Technology Department at Universal Instruments Corporation.

The research facility houses state-of-the-art process, analytical and test equipment for surface mount process development. The SMT lab has two fully functional surface mount assembly lines with in-line test and measurement equipment.

The most visible of the team's activities is participation in research consortia organized by UIC's Advanced Technology division. Other significant efforts include: developing "smart software" in the areas of expert systems, simulation software, development of a closed loop control system for solder paste deposition, software cost models, etc.

The list of research consortia to which the team has made significant contributions are listed below:

Research Consortia

• Ultra Fine Pitch (UFP) Consortium ~ 1992-1994
• BGA/DCA (Ball Grid Array/Direct Chip Attach) Consortium ~ 1994 - 1996
• DCA/CSP (Direct Chip Attach/Chip Scale Package) Consortium ~ 1996 - 1998
• Alternate Assembly Reflow Technology (AART) Project ~ 1997 - 1998

Process Research - Non Consortia

• BGA Process Research
• Advanced Solder Deposition
• Pressurized Underfill
• Solder Paste & Underfill Evaluation Project for Kester Via Universal

Software Development

• Material Selection ~ Adhesives, Solder Paste, etc. ~ 1990 - 1992
• Placement ¡®Optimization¡¯ ~ 1992 - 1994;1995 - 1996; 1997 - 1998
• Closed Loop Control of Stencil Printing ~ 1992 - 1994; 1994 - 1996
• Placement Simulation ~ 1992 - 1994; 1995 - 1996; 1996 - 1997
• Cost Models ~ 1994 - 1995; 1996 - 1997
• AARTIST - Process advisor for the AART Project ~ 1997 - 1998