'Uncertainty Management in a Manufacturing Environment Using Expert
Systems' - A. Masood - December 1989.
'A Black-Board Based Process Planning System for the Surface Mount
Manufacture of Printed Circuit Boards' - J.A. Cecil - May 1990.
'An Expert Systems Approach to Simulation in Flexible Manufacturing Systems'
- M.C. Fan - July 1990.
'A Knowledge Based Approach for Adhesive Selection and Dispensing for Surface
Mount Technology' - A. Derebail - December 1990.
'Computer Aided Process Planning for PCB Assembly Using TAB and SMT', - R.
Sundarraman - April 1991.
'An Expert System for Solder Paste Selection'- A. Maria - August 1991.
'An Integrated Expert System Environment to Support Design and Manufacturing
Activities for Printed Circuit Boards Using Surface Mount Technology'- H. Ugur -
December 1991.
'A Knowledge Based Advisor for Surface Mount Component Placement Sequence
Identification' - W. Shih - December 1991.
'An Expert System Approach to Aircraft Gate Assignment' - Y-Y. Su - December
1991.
'A Knowledge Based Approach to Profile Identification in Surface Mount
Infrared Reflow Soldering' - C-H. Wu - December 1991.
'A Surface Mount Component Placement Sequence Advisor for Multi-Batch
Production' - Y-W. Huang - May 1992.
'Update Mechanisms for a Solder Paste Advisor' - S. Hwang - May 1992.
'Solderability Testing and Evaluation by Wetting Balance Analysis' - C-Y.
Huang - May 1993.
'Knowledge Based Profile Identification in Surface Mount PCB Assembly ' -
D.W. Briggs - August 1993.
'Validation and Testing of Solder Paste Evaluation Procedures' - J. Spiegel
- August 1993.
'An Adaptable Knowledge Base for Design for Manufacturability by
Object-Oriented Approach' - Y-L. Hwang - August 1993.
'Accuracy Evaluation Methodology for Fine Pitch Surface Mount Placement
Equipment' - C.M. Gleaser - August 1993.
'Design for Manufacturing for Surface Mount PCB Assembly' - S. Krishnan -
September 1993.
'Manufacturing Cost Analysis of Surface Mount PCB Design' - M. Alexander -
September 1993.
'Closed Loop Process Control for Solder Paste Stencil Printing' - C-W. Chung
- September 1993.
'Process Study in Ultra Fine Pitch Hot Bar Reflow Soldering' - T-H. Lee -
December 1993.
'Accuracy Evaluation Methodology for Three Dimensional Laser Based Solder
Paste Inspection Equipment' - N. Montochio - April 1994.
'Measurement of Component Retention Properties of Solder Pastes for Surface
Mount Printed Wiring Board Assembly' - S. Thomas - October 1994.
'Solder Paste Rheology and Print Behavior' - S. Seshadri - October 1994.
'Testing and Evaluation of the Solder Bumps and Solder Bump Pattern Locating
Algorithms' - H. Baouche - September 1994.
'The Intrinsic Measurement of Solderability Using Wetting Balance Analysis'
- K. Dhaneshwar - March 1995.
'A Computer Aided Process Planning System for Manual Printed Wiring Board
Assembly ' - K-C. Ku - March 1996.
'Voids in Area Array Assembly' - Roland Sturm - July 1996.
'Warpage in the Area Array Microelectronic Devices' - C.K. Gurumurthy -
August 1996.
'An Investigation of the Physical Properties and Flow Behaviours of
Encapsulant Materials for Direct Chip Attach Applications' - J. L. Fossberry -
August 1996.
'Comprehensive Process Control for Solder Paste Stencil Printing' - S.
Venkateswaran - September 1996.
'Solder Paste and Flux in Area Array Assembly' - R. Parthasarathy - August
1996.
'Effect of Board Bumping, Board and Component Related Parameters on DCA
Assembly ' - N. Kini - October 1996.
'Systematic Evaluation of Adhesive Deposition for Mixed Technology PCB
Assembly' - L. M. Rielly - August 1997.
'Effects of Filling and Release Process on Solder Paste Volume Transferred
in the Stencil Printing Process' - S.S. Satagopan - August 1997.
'Effects of Board and Package Related Parameters on Fine Pitch Area Array
Package Assembly Yields' - K. Kalyan - August 1997.
'Adhesive Deposition Through Stencil Printing for Surface Mount Assembly' -
S. Prasad - October 1997.
'Comprehensive Guidelines for the Alternative Assembly and Reflow Technology
Process' - J.B. Hinerman - February 1998.
'The Reduction of Post Placement Defects in Surface Mount Assembly' - C.M.
Greene - May 1998.
'Study of Strength, Reliability and Other Issues concerning AART Solder
Joints' - R.V. Seeniraj - May 1998.
'Process Planning for Ultrafine Pitch and Area Array Surface Mount Assembly'
- L. Gopalakrishnan - May 1998.
'Stencil Printing and Solder Paste Issues for Alternative Assembly and
Reflow Technology' - S.T. Murthy - May 1998.
'Pin-in-Paste Process Development - A Production Perspective' - S.S. Tonapi
- May 1998.
'Reliability and Process Issues in DCA' - U. Putcha - August 1998.
'Development and Implementation of Shear Testing for Surface Mount Area
Array Applications' - R. Erich - August 1998.
'Process, Design and Reliability Issues in DCA Assembly' - M. Ranjan -
August 1998.
'Development of a Hypermedia Based Decision Support System for PCB
Assembly', M. Cai - September 1998.
'Implementation of the Pin-In-Paste Process in a Contract Manufacturing
Facility' - V.T. Nithyanandan - October 1998.
'Evaluation and Reliability of Small Z-Axis Interconnects' - S. Jayaraman -
December 1998.
'Assembly Process Development for Large Area Array Devices' - V. Yamunan -
December 1998.
'Investigation of Bump Distributions from the Stencil Printing Bumping
Process' - J. Schake - December 1998.
'Rework Process Development for Large Area Array Devices in High Density
Networking Products' - C. Lin - June 1999.
'Systematic Implementation of Information Automation for a Contract Assembly
Environment' - A. Hete - June 1999.
'Procurement Lead Time Reduction in an EMS Facility Using an Agent Based
System' - S. Ramakrishnan - August 1999.
'Flip Chip Process Development and Reliability Evaluation' - M.
Venkateswaran - August 1999.
'Rework of Chip Scale Packages and BGA Devices in a Contract Assembly
Environment' - A. Limaye - September 1999.
'ECO Management Using Intelligent Agents in an EMS Provider's Environment' -
N. Arslan - November 1999.
'Integration of Advanced Area Array Assembly and Microvia Technology with
Standard Surface Mount Processes' - A. Alawani - December 1999.
'Assembly Process Development for Ball Grid Array and Chip Scale Package on
High Density Interconnects' - P. Patel - December 1999.
'Evaluation of Underfill Materials for DCA Assembly' - L-Y. Cheng - December
1999.
'Encapsulant Selection & Reliability Issues in Flip Chip Assemblies' - M.
Joshi - December 1999.
'Process Reliability Issues for Thermally Enhanced Flip Chip Ball Grid Array
(FC-BGA) Packages' - B. Gopalan - August 2000.
'A Monte-Carlo Simulation to Predict the Placement Yield of Area Array
Devices' - M. Munikrishnan - August 2000.
'Reliability Evaluation of High Density Microvia Structures' - J. Joshi -
August 2000.
'Throughput Improvement in the Cab Shop of an Existing Automotive Assembly
Plant Using Computer Simulation '- V. Sampathkumar - August 2000.
'High Speed High Density PCB Design and Manufacturing '- S. Pochareddy -
August 2000.
'Yield Modeling in an Electronics Manufacturing Service Providers
Environment' - X. Zhou - August 2000.
'Estimating Manufacturing Standard Times in an EMS Providers Environment' -
P. Vithlani - August 2000.
'High Efficiency Surface Mount Adhesive Processing in an Automotive
Electronics Environment' - Vasudevan - August 2000.
'Reliability of Flip Chip Assemblies: Use of Reflow Encapsulants' -V.
Patwardhan - August 2000.
'Rework Process Development for Fine Pitch CSPs' - M. Sitaraman - September
2000.
'The Effect of Process Mapping on Planning Capacity Requirements in an EMS
Provider's Facility' J.H. Mun - September 2000.
'The Development of Lead Free Processes for PCB Assembly' - Y. Mohammed -
December 2000.
'Decision Support for BGA Assembly' - S. Phadnis - December 2000.
'Interaction of Flux and Underfill Considering Multiple Board Parameters' -
S. Mahalingam - August 2001.
'RF Product Management with an Emphasis on Test' - S. Balasubramanian -
August 2001.
'Development of Requirement Specifications and Evaluation for an Integrated
System at an EMS Provider' - R.S. Venkatesh - August 2001.
'Preventing Flux Splatter on Goldfinger Contacts - Proactive and Reactive
Solutions' - K. Vijayamadhavan - August 2001.
'New Product Introduction in High Volume, Medium/High Mix in an EMS
Provider's Environment' - P. Diwe - August 2001.
'Voids in PGBA Solder Joints' - H. Ladhar - June 2001.
'Using Simulation as a Design and Planning Tool for New Manufacturing
Systems'- S. Jumani -August 2001.
'Product Cost Quotation Using Activity Based Costing and Decision Support' -
A. Tarhalkar - September 2001.
'Site Redressing for Lead Free and Advanced Chip Scale Package Rework' - A.
Gowda - December 2001.
'The Use of Simulation and Data Mining in Yield Prediction' - S.
Gnanasambandam - December 2001.
'The Impact of Dimensional Accuracy on Yield for High Density Connectors'-
S. Nagarajan - December 2001.
'Kitting Process Improvement Using Simulation Techniques in an EMS
Environment - A Six Sigma Approach' - May 2002.
'Reliability of Blind and Buried Microvia Structures' - U. Marquez - May
2002.
'Factors Affecting Solderability of Sn/Ag/Cu Solder on Alternate Pad
Finishes' - V. Mohan - May 2002.
'Assembly of Copper Column Interconnect Flip Chip Technology' - S. Ma -
August 2002.
'Effectiveness of Automated X-Ray Inspection (AXI) Systems from a
Manufacturing Perspective' - P. Manjeshwar - August 2002.
'Minimization of Losses and Variability in Fiber Optics Assembly' - S.
Pradhan, S. - August 2002.
'Reliability of Optical Fibers - Issues in Mechanical Strength and Service
Life' - K. Nagarkar - August 2002.
'Accelerated Testing Of Flip Chip Underfills - Issues In Moisture And Aging'
- N. Vichare - December 2002.
'Evaluation Of Underfilling Methods For CSP Assemblies' - M. Rampurawala -
December 2002.
'High Temperature Moisture/Reflow Sensitivity: Underfill-Flux Compatibility
for Flip Chip Reliability' - F. Bruno - December 2002.
'Lean and Agile Manufacturing Systems: Competing or Complementary Approaches
to World Class Manufacturing' - M. Testani - December 2002.
'Towards The Optimization Of Air Cooled Heat Sinks For Microprocessors - A.
Shah - December 2003.
'Adhesives in Optoelectronics' - A. Quintenilla - December 2003.
'Moisture and Reflow Sensitivity Study On Plastic Encapsulated Surface Mount
Packages' - V. Gopalakrishnan - December 2003.
'Thermal Cycling Reliability of Double Sided BGA Assemblies' - S.K.
Mandepudi - December 2003.
'Laboratory Automation Through The Internet/Intranet' - P. Rao - December
2003.
'A Design Of Experiments Based Approach To The Optimization Of The Assembly
Of Waferized Compliant Pin Connectors' - S. Janakiraman - December 2003.
'Reliability of Optoelectronic Packages' - S. Neelamegam - May 2003.
'Implementation of Kaizen in a High Mix Low-Volume EMS Providers
Environment - A Poke-Yoke Approach' - Jayang Patel - May 2003.
'Simulation and Yield Prediction for Flip Chip Assembly' - V. S.
Poyyapakkam - May 2003.
'Relaibility Modeling and Decision Support for Flip Chip Assembly' - R.
Muthaiyan - May 2003.
'Scheduling of Electronic Assemblies in a High Mix Low Volume Environment'
- K. Sivakumar - May 2003.
'Reliability of Fluorescent Lamps Used in Flat Panel Displays' - I. Patel -
May 2003.
'Flux Only Assembly of Wafer Level Chip Scale Packages' - D. Esler - May
2003.
'Software Tools for the Optimization of High Volume Electronics
Manufacturing'- T. Vellore - August 2003.
'Reducing the Variability of Manufacturing Processes in High Volume Low Mix
Assembly' - S. Shaherwalla - August 2003.
'Lead-Free Wave Solder Process Development with VOC-Free Water Soluble Flux
Chemistry' - G. Wable - August 2003.
'DFM for PCB Assembly - H. Jadhav - August 2003.
'Scheduling for High Mix Low Volume Electronics Manufacturing Environments'
- V. Kawli - August 2003.
'Reducing Patient Turn-around Time in an Emergency Room' - T. Gandhi -
August 2003.
'Control of PTH Thickness in Realtime in a Low Volume High Mix Environment'
- D. Nandakumar - December 2003.
'DPMO - A Key Metric for Process Improvement in PCB Assembly' - S. Marrey -
December 2003.
'Ensuring High Quality Testing in an Automated Reliability Laboratory' - J.
Damania - December 2003.
'A System to Monitor the Quality and Reliability of Plated Through Hole
Assemblies' - D. Nandakumar - May 2004.
'Optimizing The Slotting Process In A Warehouse' - S. Koli - August 2004.
'Enhancing The Utilization Of Multiple Suites Of ORs Using A Simulation
Based Approach' - S. Nivarthi - August 2004.
'A Knowledge Management System For Process Improvement And Failure Pattern
Recognition In The Assembly Of Printed Circuit Boards' - P. Sathyanarayanan -
August 2004.
'Distributed Artificial Intelligence Based Labor Cost Modeling in the EMS
Industry' - M. Swaminadhan - August 2004.
'Rework of Lead-Free Ball Grid Arrays on Thick, Multilayer Printed Circuit
Boards' - J. Erlbaum - December 2004.
'An Integrated ERP - Simulation Framework for Real-time Control' - Sreekanth Ramakrishnan - May 2005.
'A Business Engineering Approach for Post ERP Production Planning in an EMS
Environment' - Sumit Parimoo - May 2005.
'The Effect of Intermetallics in Sn-Ag-Cu Solder Spheres on Joint
Reliability' - Sulakshan Mandke - May 2005.
'Target Temperatures for Lead-Free Assembly and Rework' - Zulfikar Malik -
May 2005.
