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    Home > Publications > Thesis & Dissertations > Doctoral Dissertations Directed (18)
    Doctoral Dissertations Directed (18)

    1. 'An Intelligent Model Based Process Planning Methodology for Surface Mount Technology' - M. Cala - December 1990.
    2. 'A Prototype Decision Support Framework for Surface Mount PWB Assembly' - Y-Y. Su - May 1995.
    3. 'Knowledge Acquisition for Fuzzy Knowledge Base Development in Surface Mount PWB Assembly' - C-H. Wu - July 1995.
    4. 'A Distributed, Cooperative, Homogeneous Multi-Agent Approach for Parallel Fuzzy Expert Systems in Surface Mount PWB Assembly' - H-C. Chu - December 1995.
    5. 'A Distributed Artificial Intelligence Based System for Manufacturing Systems Control in PWB Assembly' - W. Shih - February 1996.
    6. 'Process Research in the Encapsulation of DCA Components'- C-Y. Huang, August 1996.
    7. 'Yield Estimation for Surface Mount Area Array Devices' -Y-W. Huang - January 1997.
    8. 'Rework of Area Array Components' - C-W. Chung - January 1997.
    9. 'Process Optimization for Surface Mount Printed Circuit Board Assembly' - C-J. Yang - October 1998.
    10. 'Lead-Free Solder Paste Printing for EMS Providers' - C. Greene - May 2001.
    11. 'Assembly and Reliability of Lead-Free Flip Chips' - S. Tonapi - May 2001.
    12. 'Flip Chip Assembly in Air from Manufacturing and Reliability Perspectives' - Ji Hyon Mun - May 2003.
    13. 'An Experimental Approach to Develop Process Windows for Lead-Free Flip Chip Assembly from a Yield and Reliability Perspective' - Sunil Gopakumar - December 2003.
    14. 'Underfill Process Development For Lead Free Flip Chip Assembly' - R. Chaware - August 2004.
    15. 'A Systems Approach To The Reduction Of Thermal Resistance In Microelectronics Packaging' - A. Gowda - August 2004.
    16. 'Assembly, Reliability, And Rework of 0.4mm Pitch Wafer Level Chip Scale Packages' - M. Mukadam - August 2004.
    17. 'System Based Materials Design for Wafer Level Underfills' - A. Prabhakumar - December 2004.
    18. 'A Systems Approach To Reduce Processing and Materials Induced Warpage in Large Single Ply PCB Cores' - S. Kayande - May 2005.

     

     
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