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    Home > Publications > Conference Papers > Publications In Conference Proceedings (139)
    Publications In Conference Proceedings (In Reverse Chronological Order)

    1. Ramakrishnan, S., & Srihari, K., ‘Bottleneck Oriented Capacity Planning Through ERP Systems at an EMS Provider’, Pan Pacific Microelectronics Symposium, Hawaii, January 2006.
    2. Bhargava, P., Sturek, J., Peck, J., Murcko, R., & Srihari, K., ‘Integrating Quality Control Tools With Planning Modules in ERP Systems’, Pan Pacific Microelectronics Symposium, Hawaii, January 2006.
    3. Saiyed, S., Sengupta, D., Murcko, R., & Srihari, K., ‘Solder Short Failure Mechanism in System-in-Packages’, IMAPS Chicago 2005, Chicago, Illinois, September 2005.
    4. Manjeshwar, P., George, G., Damodaran, P., Castro, M., Craik, J., & Srihari, K., ‘Stencil Printing and Reflow Parameter Optimization During Assembly of 0201 Components by a Designed Experiments Approach’, SMTA Chicago 2005, Chicago, Illinois, September 2005.
    5. Gowda, A., Primavera, A.A., & Srihari, K., ‘Process and Reliability Issues with Lead-Free CSP Rework’, SMTA Chicago 2005, Chicago, Illinois, September 2005.
    6. Manjunath, D., Iyer, S., Eckel, S., Le, D., Damodaran, P., & Srihari, K., ‘Minimizing Flux Residues on the Component Body’, SMTA Chicago 2005, Chicago, Illinois, September 2005.
    7. Gowda, A., Esler, D., Paisner, S., Tonapi, S., Nagarkar, K., Acharya, A, & Srihari, K., ‘Effect of Surface Characteristics on the In-Site Performance of Thermal Greases’, SMTA Chicago 2005, Chicago, Illinois, September 2005.
    8. Nagarkar, K., Brewer, S., Tran, S., Vincent, M., Rai, R., Murcko, R. & Srihari, K., ‘Effect of Cleaning Process Parameters and Materials on Flux Residue for Flip Chip Assembly’, SMTA Chicago 2005, Chicago, Illinois, September 2005.
    9. Ramakrishnan, S., Parimoo, S., & Srihari, K., ‘Best Practices for Post-ERP Implementation an EMS Provider’, SMTA Chicago 2005, Chicago, Illinois, September 2005
    10. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., 'Flux Spatter Evaluation Using Lead-Free Solder Pastes', IPC/JEDEC Conference, San Jose, California, April 2005.
    11. Sathyanarayanan, P., Grebe, V., Murcko, R., & Srihari, K., 'Defect Tracking and Yield Enhancements Through Improved Data Collection Systems in an Electronics Manufacturing Environment', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    12. Ramakrishnan, S., Kayande, S., Murcko, R., & Srihari, K., 'Information Design Processes for Electronics Manufacturing Systems', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    13. Nagarkar, K., Murcko, R., & Srihari, K., 'Integration of QFD and DOE Methodologies for New Product Introduction in the Electronics Manufacturing Arena', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    14. Gowda, A., Esler, D., Tonapi, S., Srihari, K., & Zhong, A., 'Effect of Assembly Process Conditions on System-Level Performance of Thermal Interface Materials', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    15. Nagarkar, K. & Srihari, K., 'Integration of QFD and DOE Methodologies for New Product Introduction in the Electronics Manufacturing Arena', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    16. Chaware, R., Vichare, N., Borgesen, P., Blass, D., & Srihari, K., 'Accelerated Testing of Flip Chip Underfills and the Effect of Moisture and Temperature on the Aging of Underfills', Proceedings - SMTA International, Chicago, Illinois, Sept. 2004 (CD-ROM).
    17. Gowda, A., Greenfield, P., Srihari, K., & Sammakia, B.G., 'Structural Finite Elemental Modeling of a Multilayered Plated Through-Hole ¨C Effect of Material Properties', Pan Pacific Conference, Oahu, Hawaii, February 2004, pp.145-151.
    18. Sivakumar, K., Srihari, K., Warheit, D., & Gowda, A., 'Tactical Production Planning for Printed Circuit Board Assembly', Pan Pacific Conference, Oahu, Hawaii, February 2004, pp.221-229.
    19. Bruno, F., Granno, F., O'Keeffe, E., & Srihari, K., 'Solder Joint Evaluation of Mixed-Alloy Assemblies', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
    20. Gopalakrishnan, V., Anson, S., Venkataraman, V., Murcko, R., & Srihari, K., 'Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
    21. Janakiraman, S., Murcko, R., Srihari, K., Anson, S., & Holton, J., 'Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach', Proceedings - APEX Conference, Anaheim, California, February 2004 (CD-ROM).
    22. Mukadam, M., Meilunas, M., Borgesen, P., & Srihari, K., 'Assembly and Reliability Issues Associated with Leadless Chip Scale Packages', Proceedings ¨C IMAPS Conference, Boston, Massachusetts, November 2003 (CD-ROM).
    23. Gowda, A., Zhong, A., Esler, D., David, J., Tonapi, S.S., Schattenmann, F., and Srihari, K., 'In-Situ Performance of Silicone Thermal Interface Materials ¨C Influence of Filler Characteristics', Proceedings - Polytronic 2003, Switzerland, October 2003, pp. 177-182.
    24. Ramakrishnan, S., Kawli, V., & Srihari, K., 'A Simulation Based Control Architecture for Electronics Manufacturing Processes', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.487-493.
    25. Vellore, T., Craik, J., & Srihari, K., 'Implementation of SQC Techniques for Closed Loop Process Control in Electronics Manufacturing', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.524-529.
    26. Kawli, V., Warheit, D., & Srihari, K., 'A Study of the Accuracy of Component Placement Simulation in Electronics Manufacturing', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.138-143.
    27. Kayande, S., Adriance, J., Coleman, W.E., & Srihari, K., 'Solder Paste Stencil Printing Performance Based on Stencil and Solder Technology', Proceedings - SMTA International, Chicago, Illinois, September 2003, pp.1-5.
    28. Pradhan, S., Balasubramanian, S., Mazloom, M., Arbulich, J., & Srihari, K., 'Cycle Time and Variability Reduction in an Optical Assembly Process', Proceedings - IEMT 2003, San Jose, California, July 2003 (CD-ROM).
    29. Prabhakumar, A., Zhong, A., Tonapi, S.S., Sherman, D., Cole, H., Schattenmann, F., & Srihari, K., 'A Comparison of the Adhesion Strength of Epoxy and Silicone Based Thermal Interface Materials', Proceedings - ECTC 2003, New Orleans, Louisiana, May 2003, pp.1809-1814.
    30. Saiyed, S., Nagarur, N., & Srihari, K., 'Simulation Analysis of an Electronics Assembly Line Controlled by MRP and CONWIP Concepts', Proceedings - Industrial Engineering Research Conference, Portland, Oregon, May 2003 (CD-ROM).
    31. Wable, G., Chu, Q., Damodaran, P., Verbeist, P., & Srihari, K., 'A Comparison of Lead-Free Solder Pastes with No-Clean and Water-Soluble Flux Chemistries', Proceedings - IPC/JEDEC Lead Free Conference, San Jose, California, April 2003.
    32. Jadhav, H., Murcko, R., Brinthaupt, M., Testani, M., & Srihari, K., 'Automated Design Verification Using DFM/DFT', APEX 2003, Anaheim, California, March 2003, pp. S08-2-1 to S08-2-7.
    33. Gnanasambandam, N., Murcko, R., Grebe, V., Testani, M., & Srihari, K., 'Using Heuristics to Identify Maverick Lots at In-Circuit Test', APEX 2003, Anaheim, California, March 2003, pp. S39-3-1 to S39-3-7.
    34. Manjeshwar, P., Craik, J., Phadnis, S.S., & Srihari, K., 'Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High-Volume Low-Mix SMT Line', APEX 2003, Anaheim, California, March 2003, pp.S30-1-1 to S30-1-9.
    35. Poyapakkam, V., Borgesen, P., & Srihari, K., 'Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation', APEX 2003, Anaheim, California, March 2003, pp. S10-2-1 ¨C S10-2-5.
    36. Manjeshwar, P., Shaharwalla, S., Phadnis, S., Craik, J., & Srihari, K., 'A Six-Sigma Approach to Solder Paste Deposition for PCB Assembly', Pan Pacific Microelectronics Symposium, Kauii, Hawaii, February 2003, pp. 49-54.
    37. Patel, J., Phadnis, S., Jusufagic, F., & Srihari, K., 'Failure Modes and Effects Analysis for Electronics Manufacturing', Pan Pacific Microelectronics Symposium, Kauii, Hawaii, February 2003, pp.171-177.
    38. Pradhan, S., Arbulich, J., O'Keeffe, E., & Srihari, K., 'Evaluation of Fusion Splicers for High Strength Splicing', Proceedings - SMTA NEPCON West, San Jose, California, December 2002 (CD-ROM).
    39. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Industrial Engineering and Continuous Improvement in Health Care', 10th Annual Clinical Campus Research Session, Upstate Medical Center, Binghamton, New York, November 2002.
    40. Manjeshwar, P.K., Shaherwalla, S., Craik, J., Kirby, S., Phadnis, S., & Srihari, K., 'Qualification of Three Dimensional Solder Paste Inspection Systems for Effective In-Line Process Control', Proceedings - SMTA International, Chicago, Illinois, September 2002, pp.650-658.
    41. Vellore, T.K., Craik, J., & Srihari, K.., 'Implementing Integrated Predictive Manufacturing at an EMS Provider ¨C A Continuous Improvement Approach', Proceedings - SMTA International, Chicago, Illinois, September 2002, pp.687-695.
    42. Bahl, S., Venkatesh, R.S., Craik, J., Bedi, R., Uriarte, H., & Srihari, K., 'Requirement Specifications for an Enterprise Level Collaborative Data Collection and Quality Management Tool for an EMS Provider', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp. 140-148.
    43. Balasubramanian, S., Arbulich, J., Craik, J., & Srihari, K. 'Decision Support for Test and Debug Areas in RF Manufacturing', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp. 136-139.
    44. Patwardhan, V., Blass, P., Borgesen, P., & Srihari, K., 'Reliability Issues in Direct Chip Attach Assemblies Using Reflow or No-Flow Underfills', Proceedings - IEMT 2002 Symposium, Santa Clara, California, July 2002, pp.73-77.
    45. Gowda, A., Primavera, A., Rampurawala, M., & Srihari, K, 'Rework and Reliability of Underfilled CSP Assemblies', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
    46. Sammakia, B., & Srihari, K, 'Industry ¨C University Partnership in Graduate Research and Education', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
    47. Pradhan, S., Mazloom, A., Arbulich, J., & Srihari, K., 'Minimization of the Splice Loss between a Single Mode Fiber and an Erbium Doped Fiber', ECTC 2002, San Diego, California, May 2002 (CD-ROM).
    48. Joshi, J., Marquez, U., Primavera, A., & Srihari, K., 'Reliability Evaluation of High Density Microvia Structures', Proceedings - ICAPS 2002, Reno, Nevada, March 2002 (CD-ROM).
    49. Tarhalkar, A., & Srihari, K, 'Product Cost Estimation Using Activity Based Costing', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp. 201-206.
    50. Gowda, A., Primavera, A., & Srihari, K, 'Challenges in Lead-Free Rework', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.365-374.
    51. Diwe, P., Kini, N., Iyer, R., & Srihari, K, 'Capacity Requirements Planning in a High Volume, Medium/High Mix EMS Provider's Environment', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.214-219.
    52. Rampurawala, M., Meilunas, M., Gowda, A., and Srihari, K., 'Mechanical Reliability of Underfilled CSP Assemblies', Proceedings - Pan Pacific 2002, Maui, Hawaii, February 2002, pp.266-272.
    53. Gowda, A., Primavera, A.A., & Srihari, K., 'Rework of Lead-Free Surface Mount Components', Proceedings - APEX 2002, San Diego, California, January 2002, pp.S05-3-1 S05-3-10.
    54. Mun, J.H., Prats, A., Borgesen, P., & Srihari, K., 'Assembly Process Issues in Integrating Commercial Reflow Encapsulants into Flip Chip Assembly', Proceedings - EMAP 2001, Cheju Island, Korea, November 2001.
    55. Mahalingam, S., Mun, J.H., Prats, A., Blass, D., & Srihari, K., 'Fluxing for Flip Chip Assembly - Effect of Bump Damage', Proceedings - EMAP 2001, Cheju Island, Korea, November 2001.
    56. Pradhan, S, Balasubramanian, S, Arbulich, J, & Srihari, K, 'Implementation of Fiber Optics Assembly in a Contract Manufacturing Facility', Proceedings - SMTA Optoelectronics and Telecom Revolution Conference, Dallas, Texas, November 2001, pp.27-34.
    57. Srihari, K., Santos, D., & Sammakia, B.G., 'Industry-University Partnership: The Binghamton Model', Proceedings - SMTA International Conference, Chicago, Illinois, September 2001, pp. 672-675.
    58. Zhou, X, Ladhar, H., Gopalan, B., & Srihari, K., 'Quantifying the Effects of the factors that Influence Yield in an EMS Environment', Proceedings - SMTA International Conference, Chicago, Illinois, September 2001, pp.683-689.
    59. Srihari, K., 'Industry-University Partnership in Graduate Research and Education', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.25-28.
    60. Arslan, N., Ramakrishnan, S., & Srihari, K., 'An Intelligent Agent Based System for ECO Management in an Electronics Manufacturing Environment', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.246-251.
    61. Srihari, K., & Vichare, N., ' Supply Chain Management for Electronics Manufacturing - Challenges and Solutions', Proceedings - ILSCM 2001, Coimbatore, India, August 2001, pp.93-98.
    62. Gowda, A., Primavera, A., Srihari, K., 'Lead Free Rework Process for Chip Scale Packages', Proceedings - Advanced Packaging Technologies in the Electronics Industry Conference, Boston, Massachusetts, June 2001, pp. 99-106.
    63. Gowda, A., Murcko, R., Srihari, K., Anglin, C., & Serafini, J., 'Implementing Ball Grid Arrays in an Electronics Manufacturing Service Provider's Environment', Proceedings - Advanced Packaging Technologies in the Electronics Industry Conference, Boston, Massachusetts, June 2001, pp. 135-142.
    64. Vaithianathasamy, S., Lam, S.S.Y., & Srihari, K., 'Process Yield Prediction for an EMS Provider Using Neural Network Models', Proceedings - 10th Industrial Engineering Research Conference, Dallas, Texas, May 2001 (CD-ROM).
    65. Tonapi, S.S., Sathe, S., Srihari, K., & Sammakia, B., 'Parametric Studies of the Thermal Performance of Back-to-Back Tape Ball Grid Array Packages', Proceedings - ECTC 2001, Orlando, Florida, May 2001 (CD-ROM).
    66. Tonapi, S.S., Borgesen, P., & Srihari, K., 'No-Pb Flip Chip Assembly - Issues and Challenges', Proceedings - ECTC 2001, Orlando, Florida, May 2001 (CD-ROM).
    67. Joshi, J., Primavera, A., & Srihari, K., 'The Proximity of Microvias to PTH's and Its Impact on the Reliability of these Microvias', Proceedings - IPC Expo, Anaheim, California, March 2001, pp.S14-1-1 - S14-1-9).
    68. Pochareddy, S., Srihari, K., Satagopan, S.S., & Economou, M., 'Impedance and Propagation Delay Characterization for FR-4 Printed Circuit Boards', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 314-319.
    69. Alawani, A., Srihari, K., & DiLella, J., 'Experimental Techniques to Develop a Robust Stencil Printing Process for Diverse Interconnection Technologies', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 416-428.
    70. Vijayamadhavan, K., Kini, N., Srihari, K., & Iyer, R., 'Systematic Analysis Towards the Minimization/Elimination of Flux Spatter on Gold Finger Contacts', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 515-520.
    71. Chouta, P., Santos, D., Srihari, K., Sammakia, B., DiPietro, M., & Andros, F., 'A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes', Proceedings - Sixth Annual Pan Pacific Microelectronics Symposium, Kauai, Hawaii, February 2001, pp. 11-28.
    72. Ladhar, H., Rao, S., Yee, S., Hyland, K., Zhou, X., Gopalan, B., & Srihari, K., 'Yield Estimation in an EMS Environment', Proceedings - APEX 2001, San Diego, California, January 2001, pp. SM6-1 1 - SM6-1 7.
    73. Tonapi, S., Borgesen, P., Srihari, K., 'Effect of Flux and Reflow Parameters on the Soldering of Lead-Free Flip Chips', Proceedings - APEX 2001, San Diego, California, January 2001, pp. AT5-2 1 - AT5 -2 7.
    74. Venkatesh, R.S., Mazloom, A., Srihari, K., Kamath, S., & Craik, J., 'Solder Paste Evaluation for Lead Free Assembly', Proceedings - APEX 2001, San Diego, California, January 2001, pp. LF1-6 1 - LF6-1 9.
    75. Tonapi, S.S., Sathe, S., Srihari, K., & Sammakia, B., 'Parametric Studies on the Thermal Performance of a Tape Ball Grid Array (TBGA) Package', Symposium on Electronics Manufacturing, ASME International Mechanical Engineering Conference and Exposition, Orlando, Florida, November 2000, pp.425-431.
    76. Mohammad, Y., Srihari, K., Primevera, A., Pitarresi, J., 'Effect of Voids on the Reliability of BGA/CSP Solder Joints', Proceedings - International Electronics Manufacturing Technology Symposium, Santa Clara, California, October 2000, pp. 207-213.
    77. Schake, J., Srihari, K., & Borgesen, P., 'Stencil Design Improvement for Bumping Wafers By Printing Solder Paste', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 177-185.
    78. Limaye, A., Srihari, K., & DiLella, J., 'Rework of Mirror Imaged Area Array Assemblies', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 301-309.
    79. Pochareddy, S., Srihari, K., Gopalakrishnan, L., & Sion, V., 'Prediction of PCB Thickness for Selection of a Suitable PCB Manufacturing Technology', Proceedings - SMTA International, Chicago, Illinois, September 2000, pp. 656-663.
    80. Greene, C., Srihari, K., & DiLella, J., 'Optimizing the Stencil Printing of Lead Free Pastes Using Designed Experiments', Proceedings - SMTA Lead Free Symposium, Boston, Massachusetts, June 2000, pp. 108-114.
    81. Lin, C., Hayes, S., Srivastava, R., & Srihari, K., 'Rework of BGAs Used in Data Networking Applications', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P-EQ3/2-1 - P-EQ3/2-6.
    82. Borgesen, P., Blass, D., & Srihari, K., 'Flip Chip Reliability', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P_AP4/2-1 - P-AP4/2-8.
    83. Gopalan, B., Srihari, K, & Adriance, J.H., 'Systematic Procedures for the Process Evaluation of Solder Pastes', Proceedings - APEX 2000, Long Beach, California, March 2000, pp. P-SM1/3-1-P_SM1/3-6.
    84. Tonapi, S.S. & Srihari, K., 'Process Optimization Using Designed Experiments in an EMS Provider's Environment', Proceedings - Fifth Annual Pan Pacific Microelectronics Symposium, Maui, Hawaii, January 2000, pp. 375-380.
    85. Hinerman, J.B., Srihari, K., & Westby, G.R., 'The Pin-In-Paste (or AART) Process for Odd-Form and Through Hole Printed Circuit Boards', Proceedings - Fifth Annual Pan Pacific Microelectronics Symposium, Maui, Hawaii, January 2000, pp. 416-421.
    86. Ramakrishnan, S., Srihari, K., Egan, R.P., & Davern, J., 'Procurement Lead Time Reduction at a Contract Assembly Facility Through an Intelligent Agent Based Framework', Proceedings- Contract Manufacturing Symposium, SMTA International, San Jose, California, September 1999, pp. 16-22.
    87. Hete, A., Srihari, K., & Frisbie, R., 'Enhancing Quality in Electronics Assembly through Data Acquisition', Proceedings - Contract Manufacturing Symposium, SMTA International, San Jose, California, September 1999, pp. 583-588.
    88. Alawani, A., Yang, C-J, Srihari, K., & DiLella, J., 'Incorporating BGAs and CSPs in a High Volume Contract Manufacturing Environment', Proceedings - IPC Chip Scale and BGA National Symposium, Vol. 2, Santa Clara, California, May 1999, pp. 33-43.
    89. Satagopan, S.S., Srihari, K., & DiLella, J., 'Adhesive Printing - A Taguchi Based Approach for Process Development', Proceedings - IPC Printed Circuits Expo, Long Beach, California, March 1999, pp. S10-3-1 - S10-3-4.
    90. Santos, D.L. & Srihari, K., 'Using Computer Aided Cost Estimation for Printed Circuit Board Design and Assembly: A Review of Recent Work', Proceedings - NEPCON West 1999, Anaheim, California, February 1999.
    91. Seeniraj, R., Manessis, D., Srihari, K., & Westby, G.R., 'A Comprehensive Evaluation of the Strength of AART Solder Joints', Proceedings - 23rd IEEE/CPMT International Electronics Manufacturing Symposium, Austin, Texas, October 1998, pp. 76-85.
    92. Putcha, U., Jayaraman, S., Srihari, K., Hazar, A., & Sanyshyn, J., 'Digital Simulation as an Aid to Production Planning for a Contract Manufacturing Environment', Proceedings - IPC/SMTA Electronics Assembly Conference, Providence, Rhode Island, October 1998, pp. S14-2-1-S14-2-5.
    93. Primavera, A., Sturm, R., Prasad, S., & Srihari, K., 'Factors that Affect Void Formation in BGA Assembly', Proceedings - IPC/SMTA Electronics Assembly Conference, Providence, Rhode Island, October 1998, pp. S2-2-1-S2-2-7.
    94. Seeniraj, R., Manessis, D., Srihari, K., & Westby, G.R., 'Reliability Study of Through Hole Solder Joints Processed via Alternative Assembly and Reflow Technology', Proceedings - Surface Mount International, San Jose, California, August 1998, pp. 453-458.
    95. Primavera, A. A., Chung, C-W, & Srihari, K., 'Factors that Influence the Process, Yield, and Reliability Obtained During BGA Rework', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 51-61.
    96. Chung, C-W, Srihari, K., & Primavera, A., 'Nozzle Design and System Characterization for the Rework of BGAs', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 37-42.
    97. Gopalakrishnan, L., Srihari, K., 'Design and Implementation of an Assembly Process for BGAs Using Designed Experiments', Proceedings - IPC/SMTA Ball Grid Array Symposium, Minneapolis, Minnesota, May 1998, pp. 9-15.
    98. Gopalakrishnan, L., Ranjan, M., Srihari, K., & Woychik, C., 'Encapsulant Materials for Flip Chip Assembly', Proceedings - ECTC Conference, Seattle, Washington, May 1998, pp. 1291-1297.
    99. Ranjan, M., Gopalakrishnan, G., Srihari, K., & Woychik, C., 'Die Cracking in Flip Chip Assemblies', Proceeding - ECTC Conference, Seattle, Washington, May 1998, pp. 729-733.
    100. Venkateswaran, S., Srihari, K., Adriance, J.H. & Westby, G.R., 'A Realtime Process Control System for Solder Paste Stencil Printing', Proceedings - International Electronics Manufacturing Technology Symposium, Austin, Texas, October 1997, pp. 62-67.
    101. Huang, Y-W, Srihari, K., & Primavera, A., 'Critical Issues that Influence the BGA Assembly Process', Proceedings - NEPCON Asia, Singapore, September 1997.
    102. Hinerman, J., Srihari, K., & Westby, G.R., 'Alternate Assembly and Reflow Technology for Odd Form and Through Hole PCBs', Proceedings - NEPCON Asia, Singapore, September 1997.
    103. Huang, Y-W, Srihari, K., & Primavera, A., 'Some Factors that Could Impact the BGA Assembly Process', Proceedings - IPC/SMTA BGA Symposium, Bedford, Massachusetts, June 1997, pp. 67-76.
    104. Fillo, J., Sahay, C., & Srihari, K., 'Video Based Packaging Course', Proceedings - 44th ECTC Conference, San Jose, California, May 1997.
    105. Nagarajan, K., Santos, D., & Srihari, K., 'CACE - A Computer Aided Cost Estimation System for Area Array Devices', Proceedings - International Electronics Packaging Conference, Austin, Texas, October 1996, pp. 457-467.
    106. Huang, C.Y., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'The Wetting Balance in the Solderability Evaluation of Surface Mount Components', Proceedings - First Pan Pacific Microelectronics Symposium, Honolulu, Hawaii, 1996, pp. 187-194.
    107. Huang, C-Y, Srihari, K., McLenaghan, A.J., & Westby, G.R., 'Flux Activity Evaluation Using the Wetting Balance', Proceedings - 17th IEEE/CPMT Electronics Manufacturing Technology Symposium, Austin, Texas, 1995, pp. 344-350.
    108. Thomas, S., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'Measurement of Solder Paste Component Retention Properties', Proceedings - 17th IEEE/CPMT Electronics Manufacturing Technology Symposium, Austin, Texas, 1995, pp. 351-360.
    109. Venkatestwaran, S., Srihari, K., Adriance, J.H., & Westby, G.R., 'A Software System for the Process Control and Trouble Shooting of Solder Paste Stencil Printing', Proceedings - Surface Mount International, San Jose, California, 1995, pp. 713-719.
    110. Thomas, S., Srihari, K., McLenaghan, A.J., & Westby, G.R., 'The Measurement of Component Retention Properties of Solder Paste for Surface Mount PWB Assembly', Proceedings - Surface Mount International, San Jose, California, 1995, pp. 720-725.
    111. Chung, C.W., Srihari, K., Adriance, J.H., and Westby, G.R., 'A Process Control System for Solder Paste Stencil Printing', Proceedings - International Electronics Packaging Conference, Atlanta, Georgia, 1994, pp. 867-874.
    112. Chung, C.W., Srihari, K., Adriance, J.H., & Westby, G., 'Closed Loop Control for Solder Paste Stencil Printing', Proceedings - Surface Mount International, San Jose, California, September 1994, pp. 485-491.
    113. Alexander, M., Srihari, K., & Emerson, C.R., 'Manufacturing Cost Analysis of Surface Mount PCB Designs', Proceedings - International Electronics Packaging Society Conference, San Diego, California, September 1993, pp. 1039-1049.
    114. Alexander, M., Srihari, K., & Emerson, C.R., 'Cost Based Surface Mount PCB Design Evaluation', Proceedings - Second International Workshop on the Economics of Design, Test, and Manufacturing, Austin, Texas, May 1993.
    115. Huang, Y.W., Srihari, K., Adriance, J., & Westby, G.R., 'Heuristic Based Multiple Batch Placement Sequence Optimization', Proceedings - NEPCON West 1993, Anaheim, California, 1993, Vol. 3, pp. 1598-1607.
    116. Wu, C.H., Srihari, K., & McLenaghan, A.J., 'Knowledge Based Decision Support for Surface Mount Infrared Reflow Soldering', Thirteenth IEEE/CHMT International Electronics Manufacturing Symposium, Baltimore, Maryland, September 1992, pp. 316-320.
    117. Ugur, H., & Srihari, K., 'An Integrated Expert System Environment for DFM in Surface Mount PCB Assembly', Thirteenth IEEE/CHMT International Electronics Manufacturing Symposium, Baltimore, Maryland, September 1992, pp. 85-89.
    118. Shih, W., Srihari, K., Adriance, J., Westby, G.R., 'A Heuristic Approach to Placement Sequence Identification for SMT', International Electronic Packaging Society Conference, Austin, Texas, September 1992, pp. 631-644.
    119. Srihari, K., & Emerson, C.R., 'Knowledge Based Manufacturing Problem Diagnosis in PCB Assembly', International Electronic Packaging Society Conference, Austin, Texas, September 1992, pp. 245-257.
    120. Shih, W., Srihari, K., & Adriance, J., 'An Expert System Approach to Placement Sequence Identification for SMT', Proceedings - SMTCON '92, Secaucus, New Jersey, April 1992, pp. 129-138.
    121. Srihari, K., & Westby, G.R., 'Decision Support for PCB Assembly Using Knowledge Based Expert Systems', Proceedings - NEPCON West 1992, Anaheim, California, February 1992, pp. 545-554.
    122. Maria, A., Srihari, K., Emerson, C.R., & Westby, G.R., 'An Expert System Solder Paste Selection Advisor', Proceedings - NEPCON West 1992, Anaheim, California, February 1992, pp. 555-564.
    123. Srihari, K., Emerson, C.R., & Westby, G., 'Problem Solving in the PCB Assembly Domain Using Expert Systems', Proceedings - SMTCON West, San Diego, California, November 1991, pp. 237-246.
    124. Cala, M., & Srihari, K., 'Knowledge Based Process Planning for Surface Mount Technology', Proceedings - Eleventh IEEE/CHMT Electronics Manufacturing Technology Symposium, San Francisco, California, September 1991, pp. 235-239.
    125. Cecil, J.A., Srihari, K., & Emerson, C.R., 'Realtime Process Planning for PCB Assembly', Proceedings - Eleventh IEEE Electronics Manufacturing Technology Symposium, San Francisco, California, Sept. 1991, pp. 240-243.
    126. Derebail, A., Srihari, K., & Westby, G.R, 'Knowledge Based Adhesive Selection for SMT Assemblies', Proceedings - International Electronic Packaging Society Conference, Vol.2, San Diego, California, September 1991, pp. 1024-1035.
    127. Srihari, K., & Westby, G.R., 'Expert Systems Development for PCB Assembly Using SMT', Proceedings - SMTCON '91, Atlantic City, New Jersey, April 1991, pp. 101-109.
    128. Srihari, K., 'An Expert System Based Concurrent Engineering Approach to PCB Assembly', Proceedings - Fifth International Conference on CAD/CAM, Robotics, and Factories of the Future, Norfolk, Virginia, December 1990, pp. 355-360.
    129. Derebail, A., Srihari, K., & Emerson, C.R., 'A Knowledge Based System for the Selection of Adhesives for PCB Assembly', Proceedings - IEEE International Engineering Management Conference, Santa Clara, California, October 1990, pp. 251-257.
    130. Srihari, K., & Emerson, C.R., 'Uncertainty Management in Process Planning for PCB Assembly', Proceedings - Ninth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Washington D.C., October 1990, pp. 290-296.
    131. Cala, M., & Srihari, K., 'Artificial Intelligence in Printed Circuit Board Assembly Operations', Proceedings - 1990 International Industrial Engineering Conference, San Francisco, California, May 1990, pp. 563-568.
    132. Masood, A., & Srihari, K., 'Uncertainty Management in Computer Aided Process Planning Systems', Proceedings - International Industrial Engineering Conference, San Francisco, California, May 1990, pp. 39-44.
    133. Emerson, C.R., & Srihari, K., 'CIM Means People', Proceedings IIE Integrated Systems Conference, Atlanta, Georgia, November 1989, pp. 211 216.
    134. Srihari, K., & Greene, T.J., 'Prototype Macro CAPP System Development for FMS Cells', Proceedings Xth International Conference on Production Research, Nottingham, England, August 1989.
    135. Cala, M., & Srihari, K., 'Computer Aided Process Planning for Printed Circuit Board Assembly', Proceedings Xth International Conference on Production Research, Nottingham, England, August 1989.
    136. Srihari, K., & Greene, T.J., 'Computer Aided Process Planning (CAPP) Implementation in a FMS', Proceedings International Industrial Engineering Conference, Orlando, Florida, May 1988, pp. 519 524.
    137. Srihari, K., & Deisenroth, M.P., 'Robot Programming Languages A State of the Art Survey', Proceedings Second International Conference on Robotics and Factories of the Future, San Diego, California, July 1987, pp. 625 635.
    138. Srihari, K., & Greene, T.J., 'An Evaluation and Review of Computer Aided Process Planning Systems', Proceedings World Productivity Forum & 1987 International Industrial Engineering Conference, Washington D.C., May 1987, pp. 438 444.
    139. Srihari, K., & Greene, T.J., 'Job Release Methods in a Manufacturing Environment', Proceedings World Productivity Forum & 1987 International Industrial Engineering Conference, Washington D.C., May 1987, pp. 519 524.

     

     
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