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    Home > Publications > Conference Papers > Fully Refereed (86)
    Publications In Conference Proceedings (Fully Refereed - In Reverse Chronological Order)

    1. Damodaran, P., George, G., & Srihari, K., ‘Improving Sales Force Efficiency at a Warehouse’, Proceedings – 10th Annual Conference on Industrial Engineering Theory, Applications, and Practice, Clearwater Beach, Florida, December 2005.
    2. Damodaran, P., Thiyagarajan, A., & Srihari, K., ‘Improving the Performance of a Pick-and-Place Machine’, Proceedings – 10th Annual Conference on Industrial Engineering Theory, Applications, and Practice, Clearwater Beach, Florida, December 2005.
    3. Bhuvanesh, A., Khasawneh, M., Lam, S., & Srihari, K., ‘Can Virtual Reality Be Used To Measure and Train Operators in Electronics Manufacuturing?, Proceedings – 10th Annual Conference on Industrial Engineering Theory, Applications, and Practice, Clearwater Beach, Florida, December 2005.
    4. Greene, C., & Srihari, K., ‘Transition to a Lead-Free Process: Stencil Printing’, Proceedings – 10th Annual Conference on Industrial Engineering Theory, Applications, and Practice, Clearwater Beach, Florida, December 2005.
    5. Ramkumar Maniam, S. & Srihari, K., ‘A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging’, Proceedings – ASME IMECE, Orlando, Florida, November 2005.
    6. Manjunath, D., Iyer, S., Eckel, S., Damodaran, P., & Srihari, K., ‘A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGAs’, Proceedings – ASME IMECE, Orlando, Florida, November 2005.
    7. Gnanasambandam, N., Munikrishnan, M., Poyyapakkam, V., Borgesen, P., & Srihari, K., ‘A Yield Model for Electronics Assembly’, Proceedings – ASME IMECE, Orlando, Florida, November 2005.
    8. Nagarkar, K., Borgesen, P., & Srihari, K., ‘A Study on Optical Fiber Damage Due To Optoelectronic Assembly Processes’, Proceedings – ASME IMECE, Orlando, Florida, November 2005.
    9. Gowda, A., Zhong, A., Tonapi, S.S., Nagarkar, K., & Srihari, K., ‘Thermal and Mechanical Properties of Silicone Thermal Interface Materials with Varying Cross Linking Densities’, InterPACK 2005, San Francisco, CA, July 2005.
    10. Koli, S., Damodaran, P., Kimbler, W., & Srihari, K., 'Optimal Product Slotting', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
    11. Pradhan, S., Damodaran, P., & Srihari, K., 'Performance Analysis of Manufacturing Systems With Job Failures Using Jackson Networks', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
    12. Poyyapakkam, V., Lam, S.Y., & Srihari, K., 'Estimation of Placement Process Throughput in Electronic Assemblies Using Neural Networks', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
    13. Batra, A., Murcko, R., S. Lu, & Srihari, K., 'Process Optimization of Plated-through-hole (PTH) Process using Evolutionary Operation (EVOP)', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
    14. Ramakrishnan, S., Courtney, A., Srihari, K. and Emmick, F., 'Streamlining the Workflow at the CT Scan Area of a Healthcare Provider', Industrial Engineering Research Conference (IERC), Atlanta, Georgia, May 2005.
    15. Gowda, A., Esler, D., Paisner, S.N., Tonapi, S.S., Nagarkar, K., & Srihari, K., 'Reliability Testing of Silicone Based Thermal Greases', SEMITHERM 2005, San Jose, California, March 2005.
    16. Ramachandran, P., Damodaran, P., Madden, P., & Srihari, K., 'Optimal Placement by Branch-and-Price', Proceedings ¨C Asia and South Pacific Design Automation Conference 2005, Shanghai, China, January 2005 (CD-ROM).
    17. Ramakrishnan, S., Nagarkar, S., DeGennaro, M., Srihari, K., Courtney, A., & Emick, F., 'A Study of the CT Scan Area of a Healthcare Provider', Proceedings ¨C 2004 Winter Simulation Conference, Washington, DC, December 2004 (CD-ROM).
    18. Gowda, A., Esler, D., Tonapi, S.S., Nagarkar, K., & Srihari, K., 'Voids In Thermal Interface Materials and Their Effect on Thermal Performance', EPTC 2004, Singapore, December 2004 (CD-ROM).
    19. Ramakrishnan, S., Kayande, S., & Srihari, K., 'Intelligent Process Control in an EMS Environment', Proceedings ¨C ASME IMECE, Anaheim, California, November 2004 (CD-ROM).
    20. Pradhan, S., Arbulich, J., & Srihari, K., 'Testability of Erbium Doped Fibers ¨C An Approach Towards Yield Improvement', Proceedings ¨C ASME IMECE, Anaheim, California, November 2004 (CD-ROM).
    21. Mukadam, M., Schake, J.,Borgesen, P., & Srihari, K., 'An Investigation of Assembly Process Variables and their Impact on Voiding at a Thermal Interface', Proceedings - ITHERM 2004, Las Vegas, Nevada, June 2004 (CD-ROM).
    22. Gowda, A., Esler, D., Esler, D., Tonapi, S.S., Zhong, A., Schattenmann, F., and Srihari, K., 'Micron and Sub-Micron Scale Characterization of Interfaces in a Thermal Interface Material System', Proceedings - ITHERM 2004, Las Vegas, Nevada, June 2004 (CD-ROM).
    23. Nivarthi, S., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Enhancement of the Utilization of a Suite of Operating Rooms', Proceedings - Industrial Engineering Research Conference, Houston, Texas, May 2004 (CD-ROM).
    24. Nivarthi, S., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Effective Utilization of Ancillary Services to Reduce Patient Turnaround Times at an Emergency Room', Proceedings - Industrial Engineering Research Conference, Houston, Texas, May 2004 (CD-ROM).
    25. Gowda, A., Zhong, A., Esler, D., Esler, D., David., J., Tonapi, S.S., Schattenmann, F., and Srihari, K., 'Design of a High Reliability and Low Thermal Resistance Thermal Interface Material', Proceedings - EPTC 2003, Singapore, December 2003 (CD-ROM).
    26. Pradhan, S., Arbulich, J., & Srihari, K., 'Splice Loss Optimization of Single Mode Fiber and Erbium Doped Fiber ¨C Experiments and Issues', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
    27. Mukadam, M., Meilunas, M., Borgesen, P., & Srihari, K., 'Study of Alternate Surface Finished for Quad Flat Packs', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
    28. Gowda, A., Primavera, A.A. & Srihari, K., 'Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages', Proceedings - ASME IMECE Conference, Washington, D.C., November 2003 (CD-ROM).
    29. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Continuous Improvement in the Health Care Arena Through The Application of Industrial Methods', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
    30. Gandhi, T., Nagarkar, K., DeGennaro, M., & Srihari, K., 'Reducing Patient Turnaround Time in an Emergency Room', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
    31. Brinthaupt, M., Jadhav, H., Testani, M., Murcko, M., & Srihari, K., 'Establishing Design for Manufacturability (DFM) Criteria in a Low Volume, High Mix Electronics Manufacturing Environment', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
    32. Gnanasambandam, N., Grebe, V., Testani, M., Murcko, R., & Srihari, K., 'The Identification of Defect Clusters in Electronics Manufacturing', Proceedings - ICPR 2003, Blacksburg, Virginia, August 2003 (CD-ROM).
    33. Shah, A., Sammakia, B.G., Srihari, K., & Ramakrishna, K., 'Numerical Optimization Study for a Parallel Plate Impingement Heat Sink', Proceedings - INTERPACK 2003, Hawaii, July 2003.
    34. Su, J., Marrey, S., Damania, J., Murcko, R., & Srihari, K., 'An Integrated Capacity Planning Tool in a High Mix EMS Environment', FAIM 2003, Tampa, Florida, June 2003, pp.579-589.
    35. Wable, G., Chu, Q., Damodaran, P., Phadnis, S., & Srihari, K., 'A Systematic Procedure for Selection of a Lead-Free Solder Paste at an Electronics Manufacturing Environment', FAIM 2003, Tampa, Florida, June 2003, pp.770-781.
    36. Muthaiyan, R., Nagarajan, S., & Srihari, K., 'Optimization of Inspection through the Implementation of an Information System', FAIM 2003, Tampa, Florida, June 2003, pp.590-601.
    37. Joshi, A., Phadnis, S.S., Srihari, K., & Seeniraj, R., 'Use of Simulation to Improve the Kitting Process at an EMS Provider's Facility', Computers and Industrial Engineering Conference, San Francisco, California, February 2003 (CD-ROM).
    38. Phadnis, S.S. & Srihari, K., 'Yield Estimation for BGA Assembly', Computers and Industrial Engineering, San Francisco, California, February 2003 (CD-ROM).
    39. Muthaiyan, R., Barba, V., & Srihari, K., 'Statistical Process Control for Solder Deposition and Yield Enhancement', Computers and Industrial Engineering, San Francisco, California, February 2003 (CD-ROM).
    40. Vellore, T.K., Craik, J., Phadnis, S., & Srihari, K., 'Information-Driven Inspection Strategies for AOI and AXI Equipment in Surface Mount Manufacturing', Computers and Industrial Engineering Conference, San Francisco, California, February 2003 (CD-ROM).
    41. Harvilchuck, L., Borgesen, P., Kondos, P., Gopakumar, S., & Srihari, K., 'Passive Optoelectonics Component Manufacturing ¨C A Case Study', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
    42. Gopakumar, S., Poyapakkam, V., Borgesen, P., Blass, D., & Srihari, K., 'Lead-Free Flip Chip Assembly', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
    43. Venkateswaran, M., Borgesen, P., & Srihari, K., 'Evaluation of a Conductive Adhesive Based Approach to Lead-Free Flip Chip Assembly', Proceedings - ASME Annual Conference, New Orleans, Louisiana, November 2002 (CD-ROM).
    44. Vellore, T.K., Venkatesh, R.S., Balasubramanian, S., Craik, J., & Srihari, K., 'Information Systems for the Realtime Control of an Integrated Production Environment', Proceedings - FAIM 2002, Dresden, Germany, July 2002, pp.219-228.
    45. Mun, J-H. & Srihari, K., 'Capacity Requirements Planning for Electronics Manufacturing', Proceedings - FAIM 2002, Dresden, Germany, July 2002, pp.229-236.
    46. Shah, A., Sammakia, B.G., Srihari, K., & Ramakrishna, K., 'A Numerical Study of the Thermal Performance of an Impingement Heat Sink ¨C Fin Shape Optimization', Proceedings - ITHERM 2002, San Diego, California, May 2002 (CD-ROM).
    47. Jumani, S., Lam, S., & Srihari, K, 'Using Simulation as a Design and Planning Tool for New Manufacturing Systems', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
    48. Mohan, V., Vichare, N., Muthiayan, R., & Srihari, K, 'Dispense Expert - A Guide for Underfill Dispensing for Flip Chip Assembly', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
    49. Manjeshwar, P., Shaherwala, S., Craik, J., & Srihari, K, 'Optimizing Solder Paste Deposition for a High Volume - Low Mix SMT Line', Proceedings - IERC 2002, Orlando, Florida, May 2002 (CD-ROM).
    50. Tonapi, S.S., Borgesen, P., & Srihari, K., 'Reliability of Lead-Free Alloys - A Review', Reliability and Maintainability Conference, Seattle, Washington, January 2002, pp. 423-428.
    51. Vaithianathasamy, S., Lam, S.S.Y., & Srihari, K., 'Yield Modeling in Electronics Manufacturing Using a Hybrid System of Neural Networks and Genetic Algorithms', Proceedings - ANNIE 2001, Rolla, Missouri, November 2001.
    52. Palaparthi, S., Lam, S.S.Y., Srihari, K., & Warheit, D., 'An Heuristic Approach for Throughput Optimization of SMT Placement Machines', Proceedings - ANNIE 2001, Rolla, Missouri, November 2001.
    53. Gnanasambandam, S., Primavera, A.A., & Srihari, K., 'An Adaptive Expert System for the Reliability Prediction of Electronic Packages', 29th International Conference on Computers and Industrial Engineering, Montreal, Canada, November 2001, pp.243-248.
    54. Mun, J.H. & Srihari, K., 'Process Mapping as a Vital Tool for Capacity Requirements Planning in an Electronics Manufacturing Environment', 29th International Conference on Computers and Industrial Engineering, Montreal, Canada, November 2001, pp.123-128.
    55. Patel, P., Primavera, A., & Srihari, K, 'Assembly and Reliability of a Wafer Level CSP', Proceedings - IMAPS International Symposium on Microelectronics, Baltimore, Maryland, October 2001, pp. 89-94.
    56. Balasubramanian, S., DiPietro, M., & Srihari, K., 'Feeder Inventory Management in a Contract Electronics Manufacturing Environment', Proceedings - FAIM 2001, Dublin, Ireland, July 2001, pp.318-326.
    57. Vithlani, P., & Srihari, K., 'Estimation of Standard Times in a High Volume Medium Mix Electronics Environment', Proceedings - FAIM 2001, Dublin, Ireland, July 2001, pp. 593-602.
    58. Huang, C-Y, Lee, P., & Srihari, K., 'Simulation Modeling for the Accuracy of Placement of Electronic Devices', Proceedings - 5th Annual International Conference on Industrial Engineering Theory, Applications and Practice, Hsinchu, Taiwan, December 2000 (CD-ROM).
    59. Pochareddy, S., Vasudevan, M., Srihari, K., & DiLella, J., 'Prediction and Control of Hole-Fill and Evaluation of Novel Stencil Aperture Shapes for the Pin-in-Paste Process', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
    60. Huang, C-Y, Srihari, K., Borgesen, P., 'A Study of Defects in the Flip Chip Encapsulation Process', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
    61. Greene, C., Srihari, K., & DiLella, J., 'An Experimental Evaluation of the Self-Centering of Active Devices', Proceedings - International Conference on Production Research 2000, Bangkok, Thailand, August 2000 (CD-ROM).
    62. Tonapi, S.S., & Srihari, K., 'Process Development and Implementation for a Contract Printed Circuit Board Assembly Environment', Proceedings - 4th Annual International Conference on Industrial Engineering Theory, Applications and Practice, San Antonio, Texas, November 1999 (CD-ROM).
    63. Huang, C.Y., Srihari, K., & Borgesen, P., 'The Optimization of Underfill Dispensing Process in Flip Chip Assembly', Proceedings - 4th Annual International Conference on Industrial Engineering Theory, Applications and Practice, San Antonio, Texas, November 1999 (CD-ROM).
    64. Tonapi, S.S., Srihari, K., Serafini, J., & Testani, M., 'Implementation of the Pin-In-Paste Process in a Contract Assembly Environment', Proceedings - 15th International Conference on Production Research, Limerick, Ireland, August 1999, pp. 1211-1214 (CD-ROM).
    65. Ramakrishnan, S., Srihari, K., & Westby, G.R., 'Decision Support for the AART Process', Proceedings ¨C FAIM '99, Tilburg, The Netherlands, June 1999, pp. 1009-1020.
    66. Prasad, S., Srihari, K., DiLella, J., & Adriance, J.H., 'Optimization of the Stencil Printing of Adhesives Using a Plastic Stencil', FAIM '99, Tilburg, The Netherlands, June 1999, pp. 1021-1032.
    67. Gopalakrishnan, L., Srihari, K., & Westby, G.R., 'A Comprehensive Cost Model for the 'AART' Process', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
    68. Huang, C-Y, Srihari, K., & Borgesen, P., 'An Experimental Approach to 'Optimize' Preheat Temperature in Flip Chip Assembly', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
    69. Yang, C-J, Srihari, K., & DiLella, J., 'Optimization of Solder Paste Deposition for Ultrafine Pitch Surface Mount Devices', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
    70. Santos, D.L., Srihari, K., Yingling, M., Kenyon, B., & Orzel, R., 'Qualification Tests for TAB Package Assembly', Proceedings - Third Annual International Conference on Industrial Engineering Applications and Practice, Hong Kong, December 1998 (CD-ROM).
    71. Greene, C., Srihari, K., & DiLella, J., 'Reduction of Post-Placement Defects in Surface Mount Assembly', Proceedings - 8th International Conference on Flexible Automation and Intelligent Manufacturing, Portland, Oregon, July 1998, pp. 333-344.
    72. Gopalakrishnan, L. & Srihari, K. 'Process Planning for Area Array Component Assembly', Proceedings - 8th International Conference on Flexible Automation and Intelligent Manufacturing, Portland, Oregon, July 1998, pp. 321-332.
    73. Murthy, S.T., Manessis, D., Srihari, K., & Westby, G.R., 'A Study of Solder Paste Rheology for the Alternate Assembly and Reflow Technology (AART) Process', MRS Spring Meeting 1998, San Francisco, California, May 1998.
    74. Hinerman, J., Srihari, K., & Westby, G.R., 'AART Process Development and Improvement Through Designed Experiments', Proceedings - Second Annual International Conference on Industrial Engineering Applications and Practice, Vol. 2, San Diego, California, 1997, pp. 621-626.
    75. Madson, R., Srihari, K., & Westby, G.R., 'Yield Modeling for the AART Process', Proceedings - Second Annual International Conference on Industrial Engineering Applications and Practice, Vol. 2, San Diego, California, 1997, pp. 1325-1330.
    76. Chu, H.C., Srihari, K., & Emerson, C.R., 'A Distributed Artificial Intelligence Based Framework for Process Planning in Surface Mount PWB Assembly', Proceedings - First Annual International Conference on Industrial Engineering Applications and Practice, Houston, Texas, December 1996, pp. 83-88.
    77. Shih, W., Srihari, K., & Emerson, C.R., 'Manufacturing Systems Control in Printed Wiring Board Assembly Using Distributed Artificial Intelligence', Proceedings - Fifth Industrial Engineering Research Conference, Minneapolis, Minnesota, 1996, pp. 97-102.
    78. Su, Y., & Srihari, K., 'A Decision Support Framework for PWB Assembly', Proceedings - Third International Conference on Computer Integrated Manufacturing, Vol. 1, Singapore, July 1995, pp. 653-662.
    79. Wu, C.H., & Srihari, K., 'Automated Knowledge Acquisition for the Surface Mount PWB Assembly Domain', Proceedings - Third International Conference on Computer Integrated Manufacturing, Vol. 2, Singapore, July 1995, pp. 1408-1415.
    80. Liu, C.Y., Emerson, C.R., & Srihari, K., 'A Multi-Criteria Decision Support System for Placement Machine Selection', ASME International Electronic Packaging Conference, Binghamton, New York, September 1993, pp. 381-387.
    81. Huang, Y.W., Srihari, K., Adriance, J., & Westby, G., 'A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem', ASME International Electronic Packaging Conference, Binghamton, New York, September 1993, pp. 373-379.
    82. Krishnan. S., Srihari, K., & Emerson, C.R., 'An Integrated Design for Manufacturing Environment for Surface Mount PCB Assembly', Second Industrial Engineering Research Conference, International Industrial Engineering Conference, Los Angeles, California, May 1993, pp. 832-836.
    83. Krishnan. S., Hwang, Y., & Srihari, K., 'A DFM Framework for Surface Mount PCB Assembly', International Conference of Technology Management '93, Denver, Colorado, April 1993, pp. 207-217.
    84. Srihari, K., & Emerson, C.R., 'Knowledge Based Design for Manufacturing in Surface Mount PCB Assembly', Manufacturing Aspects in Electronics Packaging, ASME Winter Annual Meeting, EEP-Vol.2/PED-Vol.60, Anaheim, California, November 1992, pp.7-13.
    85. Srihari, K., Masood, A., & Cala, M., 'A Prototype Expert CAPP System Dealing with Uncertainty', Proceedings - Manufacturing International '90, Vol. 1, Atlanta, Georgia, March 1990, pp. 67-72.
    86. Srihari, K., Cecil, J.A., & Emerson, C.R., 'An Application of Petri Nets in FMS Modeling, Analysis, and Control', Proceedings - Manufacturing International '90, Vol. 2, Atlanta, Georgia, March 1990, pp. 107-112.

     

     
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