Overview
Analog Devices
Endicott Interconnect Technologies, Inc. (EIT)
General Electric Company (GE)
Hidden Valley
IBM
Motorola
Solectron
Texas Instruments
United Health Services (UHS)
Universal Instruments
Virtua Health
Research

Identification of process, assembly, test and operational issues in the area of Fiber Optics Packaging

Packaging of electronic products using fiber optics products is a recent trend at an EMS provider. The research at Sanmina involves the identification of process, assembly, test and operational issues in the area of fiber optics packaging. Experiments are being conducted to understand the mechanism behind the 'fusion-slicing' process, which is the key process in this area. Statistical methods like the "Design of Experiments" are being applied to minimize the losses between fibers like the SMF (Single Mode Fibers) and the EDF (Erbium Doped Fiber). Case studies are being conducted to address the 'Fibre Management' issues within these products. Quality tools like PFMEA (Process Failure Mode and Effects Analysis) are being used in such an environment.

 

 
sitemap | contact us