Seminar on the Next Five Years in Semiconductor Packaging Technology Challenges

Presented by: Mario Bolanos

Tuesday, 28^th February, 2006, 4:30 pm to 6:00 pm

The Spring 2006 SMTA meeting kicked off with an exciting seminar on semiconductor packaging technology challenges in the next five years. A guest speaker from Texas Instruments, Mr. Mario Bolanos, currently serving as the Technical Director of the Semiconductor Packaging Organization at Texas Instruments, spoke to over 32 students and 6 professors about the industry challenges.  Mr. Bolanos provided a detailed insight into the transitional phases that were required to maintain with the current market trends.  Since over 50% of the electronics market is being driven by consumer electronics, Mr. Bolanos highlighted a few of today’s market trend that included: time to market, increased functionalities of products, and long term outlook of the markets.  The approaches to minimize the constraints were outlined such as the System in Packaging (SIP) and System on Chip (SOC) technologies as well as the effects on thermal density, new packaging materials and scaling technologies.  This is the third consecutive year that Mr. Mario Bolanos has spoken at the SUNY Binghamton University SMTA Student Chapter meeting.