An Experimental Study on Voids in Area Array Devices in Mixed Alloy Assemblies

Presented by: Felix Bruno

felix_bruno@yahoo.com

Tuesday, 7^th March, 2006, 5:00 pm to 6:00 pm

A seminar was held by Felix Bruno on March 7, 2006, a current Doctoral student at Binghamton University, presented recent findings in the mixed alloy assemblies.  As the electronics manufacturing industry transitions from tin-lead soldering to a lead free environment, it will become even more critical that enterprises efficiently facilitate this transformation.  Therefore a comparative analysis was outlined showing the effects on namely three types of array assemblies: eutectic tin-lead, lead free and mix alloys in terms of voids.  The seminar included a detail description of recent research that was conducted in a relatively a new area incorporating the formation of voids in the mixed alloy assemblies due to surface contamination, moisture absorption, solder paste, operations conditions and reflow profile. Furthermore, by optimizing the reflow profile characteristics, a reduction in the overall impact on the formation of voids could be achieved.  Felix elaborated further on how the research was aimed at studying reflow characteristics that included the time above liquidus, solder volume, component pitch and surface finish.  Further analysis was conducted to explore the relationship between voids and failure analysis, the reliability of such occurrences.