Tour of Endicott Interconnect Technologies, Inc. Facilities

Presented by: Michael Cummings

Friday, 18^th November, 2005, 10:00 am to 12:30 pm

The BU SMTA student chapter visited Endicott Interconnect Technologies, Inc. for the second consecutive year to tour the PCB fabrication process.  EIT is a leading provider of complex assembly solutions that combine elements such as silicon packaging, design, printed circuit board fabrication assembly and service. The tour was held on November 18^th, 2005 with over 10 students in attendance.  The program consisted of a one hour discussion panel, followed by a one-an-one half hour tour of the facilities.  Students were exposed to the materials typically used for the PCB fabrication process.  Michael Cummings, a mechanical engineer for over 20 years provided the tour for the students along with the assistance of Mark Bentlage, a manager for EIT.  Students involved with the tour were able to have a deeper understanding of the material handling process and found the session to be informative as well as practical in their research areas.