Issues in Ultra Fine Pitch Flip Chip Assembly

Presented by: Kaustubh Nagarkar

nagarkar@research.ge.com

Thursday, 27^th October, 2005, 4:00 pm to 5:30 pm

Kaustubh Nagarkar, a Doctoral Candidate in the SSIE department, presented a very informative session on issues in the assembly process of ultra fine pitch flip chips.  The various findings from his research at General Electric were presented in this seminar. Additionally, the seminar also provided a brief overview of the new materials in thermal management of electronic assemblies.