Assembly Issues in Flip Chip Packaging

Presented by: Vivek Venkataraman

Vivek.Venkataraman@eitny.com

Thursday, 10^th November, 2005, 4:00 pm to 5:30 pm

Vivek Venkataraman, a Doctoral Candidate in the SSIE Department shared his experiences in the field of flip chip packaging, especially from an assembly perspective. The seminar also focused on the ‘state-of-art’ designs of flip chip packages. Moreover, Vivek shared the topics he has been researching on in the domain of electronics packaging.