Fall 2007 Events
| Date | Topic | Presented by: | Location | Abstract | Presentation |
| 28th Aug 2007 |
Packaging Technology Trends and Applied Research Opportunities |
Mario Bolanos | UU 221B | * | * |
| 4:30 PM | |||||
| 14th Sep 2007 | A Novel Anisotropic Conductive Adhesive for Lead-Free Assembly | Ramkumar Maniam | Dean’s Conference Room, LSG-532 | * | * |
| 8.30 AM | |||||
| 20th Sep 2007 | A Simulation-Based Framework for Enabling Business Process Driven Operations Management in a Global Business Environment | Sreekanth Ramakrishnan | Engineering Bldg K-Conference Room | click here | * |
| 8.30 AM | |||||
| 30th Oct 2007 | Experimental Study of Electromigration in Flip Chip Packages | Mukesh K. Selvaraj | IEEC Conference Room | * | * |
| 8.30 AM |
Spring 2007 Events
| Date | Topic | Presented by: | Location | Abstract | Presentation |
| 9th Feb 2007 |
A Systems Approach to assigning PCB Inner Layers to Product Clusters |
Justin Sturek | IEEC Conference Room | click here | click here |
| 4:00 PM | |||||
| 7th Mar 2007 | Investigation of Parameter Involved Ball Bond Degradation of First Level Interconnect | Santosh Kudtarkar | SSIE Conference Room | click here | * |
| 8:00 AM | |||||
| 16th Mar 2007 | Experimental Study of Electromigration in Flip Chip Packages | Mukesh Selvaraj | SSIE Conference Room | click here | * |
| 8.00 AM | |||||
| 22nd Mar 2007 | Packaging Technology Trends | Mario Bolanos (TI) | ITC Room 2221 | click here | * |
| 4.00 PM | |||||
| 23rd Apr 2007 | "Urgent Microelectronics Packaging Research Projects | Peter Borgeson (Unovis) | IEEC Conference Room | click here | click here |
| 5.00 PM |
* Please contact the office bearers for the presentation
Fall 2006 Events Abstracts of Presentations at SMTA International Conference, September, 2006, Chicago, IL
Date
Topic
Presented by:
Location
Abstract
Presentation
11th Sep 2006
Impact of Leadership on Enterprises
Justin Sturek
IEEC Conference
Room
click here
click here
4:30 PM
25th Sep 2006
Joseph Therriault
Deans
Conference Room
click here
5:00 PM
2nd Oct 2006
Plant Visit to
Unovis, Binghamton, NY
Joseph Therriault
/ Ashok Viswanathan
Unovis
report
photos
5.30 PM
16th
Oct 2006
Very
High Density Metric Interconnect
Davide Fusco
Deans
Conference Room
click here
click
here
4.30 PM
6th Nov 2006
Conductive Adhesives using
Nanometer sized particles for Improved Performance
Ashok Pachamuthu
Deans
Conference Room
click here
click here
4.30 PM
20th Nov 2006
Process Development for Flexible Flip Chip
Connection
Ta-Hsuan Lin
Deans
Conference Room
click here
*
4.30 PM
|
Date |
Title |
Authors |
Abstract |
| 27th Sep 2006 |
Characterization of Solder Paste Deposition for 01005 Components |
Ashok Viswanathan and Krishnaswami Srihari, Ph.D., State University of New York at Binghamton; Jeff Schake, DEK USA, Inc |
|
| 27th Sep 2006 |
Impact
of Lead Free PCB Surface Finishes on Microvoiding |
Guhan Subbarayan, Purushothaman Damodaran, Ph.D. and Krishnaswami Srihari, Ph.D., State University of New York; Robert Kinyanjui, Ph.D., Mulugeta Abtew and Dana Korf, Sanmina-SCI Corporation – Technology Development Center (TDC) |
|
Events during Academic Year 2005 - 2006
| Date | Event | Location | Contact Details |
| 18th Apr 06 | Reliability Considerations for CPIN Connectors | IEEC Conference Room | Steven Brewer |
| 5:00 PM | bj90640@binghamton.edu | ||
| 30th Mar 06 | Roll-to-Roll Manufacturing: An Introduction | SSIE Conference Room | Joseph Therriault |
| 8:00 AM | josephtherriault@yahoo.com | ||
| 24th Mar 06 | Lean and Agile & Importance of Corporate Culture | Enginet Classroom EBJ15 | Michael V. Testani, IBM |
| 1:00 PM | testani@us.ibm.com | ||
| 21st Mar 06 | Virtual Reality in SMT Placement Machine Training | IEEC Conference Room | Abhinesh Bhuvanesh |
| 5:00 PM | abhinesh@binghamton.edu | ||
| 7th Mar 06 | A Study on Voids in Area Array Devices | IEEC Conference Room | Felix Bruno |
| 5:00 PM | felix_bruno@yahoo.com | ||
| 28th Feb 06 | Semiconductor Integrated Circuit Packaging Trends | IEEC Conference Room | Mario Bolanos, Texas Inst |
| 4.30 PM | |||
| 18th Nov 05 | A Tour of the Panel Fabrication Area, Endicott Int | Endicott Interconnect | Priyanka Bhargava |
| 9:00 AM | bhargava@eitny.com | ||
| 10th Nov 05 | Assembly Issues in Flip Chip Packaging | IEEC Conference Room | Vivek Venkataraman |
| 4.00 PM | Vivek.Venkataraman@eitny.com | ||
| 27th Oct05 | Issues in Ultra Fine Pitch Flip Chip Assembly | IEEC Conference Room | Kaustubh Nagarkar |
| 4.00 PM | nagarkar@research.ge.com | ||
| 13th Oct 05 | The Impact of Leadership in Organizations | IEEC Conference Room | Justin Sturek |
| 4.30 PM | jsturek1@binghamton.edu |