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With increasing network bandwidth and speed requirements, interconnection technologies are moving towards high density and high speed connector systems. Increasing the signal density and speed of data transfer between a mother board and a daughtercard is one of the key areas of research in the interconnects industry. High density compliant pin connectors are a result of research and development in this area. Since most contract manufacturers have dealt with wave soldered connectors for many years, assembly of compliant pin connectors has posed quite a challenge. To this end, this research addresses most of the issues faced from an assembly perspective by focussing on the mechanical design of these connectors and evaluating failure modes from experiments and production. This research focusses on the key factors affecting this assembly process and a structured approach is proposed towards launching these products to manufacturing. One of the prime issues associated with high density connectors is the correct alignment of the pins into the Plated Through Hole (PTH) and a gas-tight connection of iii the compliant part with the PTH when pressed. The connector and Printed Circuit Boards (PCB) were characterized and a dimensional tolerance analysis was done to evaluate windows of process tolerance available. Recommendations were made to the raw board design and compliant pin true position verifications processess. The forces involved with pressing high density compliant pin connectors are very high. This fact mandates a need for mechanical perfomance testing of the connectors on the type of PWBs. Failure modes are discussed for different connector pin configurations based on different possible test procedures. Given the electrical robustness and the wafer-based configuration of these connectors, assembly is a challenge that requires operator dexterity and careful handling. To this end, some of the manufacturing concerns and potential problems are addressed in this research along with solutions. The findings of this research and ideas discussed could be used as a process guide to help develop a process for introduction, qualification and assembly of high density compliant pin connectors.


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