Masters Abstracts (1991)

RAGHAVAN, SUNDARRAMAN
(April 1991)

Email: Not Available

Computer Aided Process Planning for PCB Assembly Using TAB and SMT

Process planning is a critical function in any manufacturing domain. Few CAPP systems have been developed within the electronics packaging domain. These prototype systems have considered either insertion mount or surface mount components only. Tape Automated Bonding (TAB), though a relatively new technology, is gaining importance in electronics assembly due to its inherent advantages. The advent of fine pitch technology together with the ever increasing need for more inputs/outputs and greater pin counts in computer chip applications has enhanced the use of TAB technology in electronics packaging. This trend has been further augmented by the increasing need for compactness in consumer electronics.

This research designed and developed a prototype CAPP system for the Printed Circuit Board (PCB) assembly domain. The system developed generates a process plan for PCBs populated with SMT and/or TAB packages. An artificial intelligence based expert system approach has been used in the CAPP system's design and development process.