Masters Abstracts (1993)

HUANG, CHIEN-YI
(May 1993), Ph.D. Professor, Department of Industrial Management, Huafan University, Taiwan, Taipei, Taiwan

Email: huang107@ms17.hinet.net

Solderability Testing and Evaluation by Wetting Balance Analysis

The increased use of Surface Mount Technology (SMT) in Printed Circuit Board (PCB) assembly is a result of the need for reduced weight, volume and cost in electronic packaging. While traditional electronic (through hole) PCB assembly technology has essentially reached its limits, SMT has offered a possible solution to achieve the needs of the market with respect to cost, weight, volume and reliability.

Solderability is one of the most important factors to be considered during the conversion from conventional through hole technology to surface mount PCB assembly. Even though solderability is important for conventional technology, the solderability requirement of components and boards becomes even more critical for surface mount PCB assembly because the solder joint needs to provide both the electrical and mechanical connection. Solderability evaluation for surface mount components and the identification and study of factors that influence it are of primary importance in the surface mount manufacture of PCBs.

The wetting balance test method is performed as a quantitative investigation of solderability. This research interprets issues that concern wetting balance solderability evaluation and the generation of a validated test procedure for various types of surface mount components. Besides, this research provides a method for quantifying flux activity through the use of the wetting balance test procedure. The results obtained can serve as a bench mark for the candidate fluxes that might be considered for a manufacturing process.