Masters Abstracts (1994)

BAOUCHE, HOCINE
(September 1994)

Email: tiger160@tiac.net

Testing and Evaluation of the Solder Bumps and Bump Pattern Locating Algorithms

The process limitation of surface mount assembly of printed circuit boards (PCBS) and the ever- increasing demands for larger numbers of input/output connections has lead the industry to consider the use of the "Direct Chip Attach" technique. This research is concerned with a critical issue in this domain, namely, the location of solder bumps and the recognition of their corresponding patterns on a bare die.

The overall objective of this research is to investigate a newly developed "Solder Bumps and Solder Bump Locating Algorithm" and assess its ability to locate a flip chip bump pattern within a machine vision reference frame and to generate its x, y, and theta offsets with respect to that frame. This research consist of two experimental investigations both of which are concerned with this critical issue.