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The effect of varying the process conditions and decreasing the stand off height of the assemblies was studied through a series of experiments. It was observed that the reliability of the DCA assemblies is negatively impacted by a decrease in the stand off height. The effect of moisture concentration in the solder mask and the laminate was studied by exposing the assemblies to different temperature and humidity conditions. It was concluded that the moisture concentration in the solder mask is insufficient to affect the adhesion of the encapsulant. Moisture exposure in the laminate does negatively affect the reliability of the DCA assemblies. The effect of warpage in the assemblies under identical curing conditions of the encapsulant was studied. Variations in warpage under identical curing conditions did not seem to affect flip chip reliability. The reliability of the assemblies encapsulated using the pressurized underfill process and the conventional capillary flow process was compared. The effect of die size, proximity, and layout was studied on two different substrate pad metallurgies. It was observed that the integrity of the solder joints was significantly affected by the choice of substrate pad metallurgy.


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