Masters Abstracts (1998)

SEENIRAJ, RAMPRASAD
(August 1998), Product Manager - Flip Chip CSP, Amkor Technology, Chandler, AZ

Email: ramprasadseeniraj@ca.slr.com

Study of Strength, Reliability and Other Issues Concerning the AART Solder Joints

The successful implementation of a high yield AART process necessitated the research of various materials, design and process related issues. This research effort systematically evaluated the factors that significantly affect some facets of AART. Those included component properties, stencil, board design, strength and reliability testing. The strength study, which forms a significant part of this research, focused on the evaluation of the strength of solder joints formed via the AART process. Since constraints such as board layout and component characteristics could preclude the deposition of the requisite amount of solder paste, this strength study also characterized the tensile strength of solder joints that are formed when a less than optimal solder volume was deposited. Through experimentation, this study proved that the strength and robustness of through hole solder joints formed through the AART process are as good as wave soldered joints. It benchmarked the strength of solder joints formed via the AART process against the traditional wave soldering process.