Masters Abstracts (1999)

JAYARAMAN, SURESH
(January 1999), Packaging Engineer, Conexant Technologies, Inc., Newport Beach, CA

Email: suresh.jayaraman@hotmail.com

Evaluation of Reliability of Small Z-Axis Inter Connects

Area array packages have increased the pressure on substrate technologies and interconnecting them has become a significant challenge. Conventional substrates, with drilled and plated through holes, are often incapable of meeting the density requirements of the high I/O packages. Extensive development is being conducted on z-axis interconnect technology to address density and routing issues. This research studied various z-axis interconnect technologies. The reliability of the z-axis interconnect formed by various via formation technologies was determined through extensive Liquid-To-Liquid Thermal Shock (LILTS) testing. This was followed up with failure analysis to determine the failure mechanisms. The possible causes of these failures were analyzed. Via diameter, pad diameter, and via formation technologies were the major factors considered in the evaluation of reliability of z-axis interconnects. A high-density test vehicle, built to a standard design by twenty different board vendors, was characterized to evaluate the capabilities of the different board build up technologies. Further, this exercise proved useful in gaining insights into the various z-axis interconnect generation technologies.