Masters Abstracts (1999)

LIN, CHANGHONG
(June 1999), Test Development Engineer, Nortel Networks, Santa Clara, CA

Email: linc@nortelnetworks.com

Rework Process Development For Large Area Array Devices in High Density Networking Products

In this research, a robust process was systematically developed for the rework of large I/O BGAs that are used on assemblies within computer networking equipment. The assemblies considered in this research were large high-density boards that were populated with multiple different BGAs. First, the equipment used was thoroughly characterized. Component removal and replacement profiles were developed for a variety of BGA components ranging from micro-BGAs to large, high I/O BGA components. The knowledge gathered through this research was captured in a personal computer based Decision Support System (DSS). The DSS, consisting of three functional modules, helps an engineer set-up the rework station and rework a BGA assembly. The functional modules within the DSS are process knowledge and instructions, process and profile recommendation tool, and supporting data modification tool. All the thermal profiles developed were stored in a database for use at a later date.