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This research effort was focussed on process development related issues and their impact on the reliability of flip chip assembly. The effect of different material properties on flip chip reliability has been systematically studied in this research. Designed experiments were performed to enhance the understanding of the interaction between the flux and the encapsulant, and its effect on voids in underfill as well as solder extrusions. The impact of voids and extrusions on reliability was evaluated. The failure mechanism that is exemplified by comer delamination was dealt with. The various factors affecting fillet cracking were studied. The effect of fillet thickness, pad metallurgy, and stand off on fillet cracking was evaluated. The pad metallurgy does have an effect on fillet cracking. Studies have indicated increased and earlier cracking of thicker fillets. The feasibility of using ECAs as a potential replacement to solder was evaluated. the material considered showed promising results towards being a possible replacement to lead based solder. Print experiments that focussed on increasing assembly yield have been performed. The reliability of these materials in air-to-air thermal cycling, moisture exposure, and liquid-to-liquid thermal shock was evaluated.


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