Masters Abstracts (1999)

YAMUNAN, VINU
(January 1999), Package Development Engineer, Texas Instruments, Dallas, TX

Email: vinu@dsbmail.itg.ti.com

Assembly Process Development For Large Area Array Devices

This research effort studied the entire assembly process and the various issues involved in the assembly of flip chip devices onto organic substrates. The flux application process was investigated for water-soluble and no-clean formulations of liquid and tacky fluxes. Their impact on assembly and reliability issues was studied. The potential of the solder reflow process as a bake-out process for boards exposed to moisture was studied. A software based cost model was developed to help an informed user to quickly estimate the cost differential for changing from one packaging technology to the use of CSPs. It allows sensitivity analyses and provides decision support by means of activity based costing principles.