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Area array packages are being increasingly used in the surface mount Printed Wiring Board (or PVVB) assembly domain. These packages are increasingly gaining acceptance within the electronics industry due to their unique characteristics and high process yields. Several researchers have indicated that the process defects associated with the Ball Grid Array (BGA) components on PWB assemblies process are dramatically lower than those experienced with traditional leaded components. However, there are a number of other reasons to remove and replace components including package defects, engineering changes that are required after a number of components have been assembled, device or system upgrades, misregistration, wrong component orientation, etc. Therefore, unless the manufacturer is prepared to throw away a significant number of expensive PWB assemblies, a rework process must be developed along with the primary assembly process.

However, the rework of BGA components is a challenging task since the solder joints are hidden from view and cannot be readily accessed. Traditional approaches to rework that are applied to peripheral leaded or leadless components might not be applicable to BGA components. This research focused on the methodical development of a robust rework process for BGA components. The development of a rework process for BGA components focused on the capabilities of rework system, nozzle design, the moisture sensitivity of plastic BGA components (PBGAs), the component removal process, the need for site redressing and the technique to be used, solder and flux application, and the component replacement process. A series of experiments and studies were pursued. A rework process is developed for BGA components. The reliability of the reworked components was compared to the non-reworked components to validate the process parameters developed in this research.


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