Doctoral Abstracts (1990-2001)

YANG, CHAN-JER
(May 1998), Taiwan

Email: cjyang@mhit.edu.tw

A Systematic Approach for the Optimization of Ultrafine Pitch and Area Array Assembly

This research had two major objectives. The first objective was to provide and validate a systematic method to 'optimize' the surface mount printed circuit board assembly process. The process steps considered range from stencil printing through reflow soldering. The second focus was the identification of a systematic process to transition to a no-clean assembly process. Process improvement and capability studies will be performed to build up the knowledge base and to validate concepts. An in-depth understanding of process features would allow for meaningful experiments to be statistically designed and applied to model the characteristics of the stencil printing and reflow processes. A predictable 'optimal' process can then be obtained based on these models. Guidelines for the transition to a no-clean process will be identified and validated through this research.